An electrical box and potting method for improving poor heat dissipation of a heat dissipation module
A technology of heat dissipation module and electrical box, applied in cooling/ventilation/heating transformation, modification by conduction heat transfer, household appliances, etc., to improve adaptability, avoid poor fit, and prolong life.
Active Publication Date: 2022-01-28
GREE ELECTRIC APPLIANCES INC
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Problems solved by technology
[0003] The object of the present invention is to provide an electrical box and a potting method for improving the poor heat dissipation of the heat dissipation module, so as to solve the problems raised in the above-mentioned background technology
Method used
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[0021] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0022] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
[0023] In the present invention, unless stated otherwise, the used orientation words such as "up, down, left, right" usually refer to figure 1 Up and down and left and right are shown. "Inner and outer" refer to the inner and outer on the specific outline. "Far and near" refer to far ...
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The invention discloses an electrical box and a potting method for improving poor heat dissipation of a heat dissipation module, and relates to the field of special air conditioners. Filling strips with a hollow structure made of materials with a low expansion coefficient of sealing glue; paste the filling strips on the base; weld the heat dissipation module to the PCB board; install heat dissipation parts on the surface of the base; Fix it on the base; install the electrical box body, inject potting glue into the electrical box body from the top of the PCB board for potting treatment, and form a potting body after potting and molding; dry the potting body; naturally at room temperature Cool the potting body; cover the electrical box cover and seal and package the factory to avoid poor bonding between the module and the radiator caused by the potting glue during the potting process, improve the adaptability of the controller to thermal stress during the working process, and prolong the life of the controller .
Description
technical field [0001] The invention relates to the field of special air conditioners, in particular to an electrical box and a potting method for improving poor heat dissipation of a heat dissipation module. Background technique [0002] Special air conditioners, such as passenger car air conditioners and aircraft auxiliary cooling systems, must meet the extreme harsh working environments of high and low temperatures, while high-power compressors or fan controllers must meet the requirements of moisture-proof, dust-proof, and high-temperature resistance. The controller is sealed with potting glue, which can effectively prevent moisture and dust, improve the reliability of electronic components, and prolong the working life of electronic components. During the potting process of electrical boxes or controllers, high-temperature liquid potting glue is injected into the upper surface of the controller, penetrates into the lower surface, and is dried by blasting to form a solid...
Claims
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IPC IPC(8): H05K7/20B29C45/14B29B11/04
CPCH05K7/2039B29B11/04B29C45/14B29L2031/34
Inventor 梁尤轩沈军谭锋赵桓
Owner GREE ELECTRIC APPLIANCES INC