Environment-friendly sectioning device for semiconductor silicon crystal bar production

Abstract

The invention relates to the technical field of semiconductors, and discloses an environment-friendly sectioning device for semiconductor silicon crystal bar production. The environment-friendly sectioning device comprises an operating table, wherein a main shaft is arranged below the operating table; a rotating column is fixedly arranged outside the main shaft; a sleeve is arranged outside the rotating column; the rotating column is movably connected with a sliding block; a moving plate is fixedly connected to the right end of the sliding block; a positioning track is arranged at the right part of the moving plate; a movable cylinder is rotationally installed on the moving plate; a limiting block is arranged in the movable cylinder; and a stop block is arranged at the left side of the movable cylinder. According to the device, the rotating column pushes the sliding block to move rightwards, the sliding block drives the moving plate to move rightwards, the limiting block enters a square groove to drive a moving device to move rightwards at a certain distance, and a movable part drives a clamping piece to move upwards to extrude materials, so that the moving device drives the materials to move rightwards at a certain distance when moving rightwards, then cutting operation is carried out, and accurate cutting of the materials is completed; and moreover, the cut materials are thesame in specification, and material waste caused by unqualified materials is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an environment-friendly sectioning device used for the production of semiconductor silicon crystal rods. Background technique [0002] Wafer is a kind of semiconductor material. Semiconductor materials are widely used in production, and the demand for wafers is also very large. After the wafer is decomposed and then added with corresponding materials, silicon ingots can be obtained. Silicon ingots After slicing, chamfering, polishing and other steps, it will become the basic raw material silicon wafer of the integrated circuit factory. Among them, the slicing process is more critical in the production process of silicon ingots, and many equipments on the market are currently slicing The length of the cutting section cannot be precisely controlled during the process, so a large number of substandard products are produced, resulting in waste of resources, and a large amount ...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the existing technology, the invention provides an environmentally friendly cutting device for the production of semiconductor silicon crystal ingots. It has precise cutting and can adjust the length of the cutting. It has a wide range of applications and collects scraps while cutting. It solves the problem of material waste caused by inaccurate cutting, cannot be applied to the cutting requirements of different specifications, and the scrap generated by cutting pollutes the environment and affects the quality of cutting products.

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