Detection method of BGA solder ball for integrated circuit packaging

Abstract

The invention discloses a detection method of a BGA solder ball for integrated circuit packaging. The detection method comprises the steps of Step.1, Step.2, Step.3, Step.4, Step.5, Step.6 and Step.7.The Step.1 comprises the measurement of a solder ball diameter, true sphericity and surface quality, electrostatic treatment and a Ball shot test; the Step.1 comprises the measurement of a solder ball diameter, true sphericity and surface quality, electrostatic treatment and a Ball shot test; the Step.2 is diameter detection, specifically, testing the ball diameter by adopting an XRay method. Bydetecting the diameter of the solder ball, the true sphericity, the surface quality evaluation, the electrostatic treatment, the production line import verification, the Ball shot and the like, the detection indexes are more systematic and comprehensive. The defects of non-welding, ball jumping, holes, welding spot deviation and the like of welding spots in the ball mounting process are reduced, the percent of pass after ball mounting is comprehensively improved, and the detected BGA solder balls can be suitable for the field of higher-end packaging.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a method for detecting BGA solder balls used in integrated circuit packaging. Background technique [0002] The full name of BGA is Ball Grid Array (PCB with ball grid array structure). This method has the advantages of small packaging area; increased function and increased number of pins; PCB board can be self-centered when soldering, easy to tin; high reliability; Good performance, low overall cost and other characteristics, the application is more and more extensive. Developed countries such as Europe, America, Japan, and South Korea have conducted research on BGA solder balls earlier, including ball-making equipment, ball-making technology, and solder ball detection methods. Leading the development direction of the world's BGA industry, it is in a global monopoly position. my country's BGA solder ball products still need to rely on imports. Due to the ...

AI Technical Summary

Problems solved by technology

Due to the small size and high precision requirements of BGA packaging solder balls, solder ball preparation technology and detection technology have always been the main reasons for restricting the development of this industry.

Insufficient solder ball detection will lead to defects such as unsoldered solder joints, jumping balls, voids, and solder joint offsets during the ball planting process, causing component failures and serious accidents

For example, in 2014, the Airbus A320-216 AirAsia QZ8501 crashed in Surabaya, the second largest city in Indonesia, on its way to Singapore. On December 1, 2015, after nearly a year of investigation by the Indonesian National Transportation Safety Committee, it was found that the aircraft rudder The BGA solder joints on the A and B channel circuit boards in the control unit module (RTLU) cracked, causing the electrical connection of the instrument to be disconnected, which in turn caused the entire control unit to fail

[0003] Some domestic scientific research institutes and enterprises have made some progress in the research on BGA. In recent years, domestic BGA solder balls have gradually come out. Only applicable to low-end industries such as rework

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