The invention discloses a method for detecting BGA solder balls for integrated circuit packaging, including Step.1, Step.2, Step.3, Step.4, Step.5, Step.6 and Step.7; the Step. 1 includes solder ball diameter, true sphericity, surface quality, electrostatic treatment and Ball shear test; said Step.1 includes solder ball diameter, true sphericity, surface quality, electrostatic treatment and Ball shear test; said Step.2 is the diameter detection, specifically, the X-Ray method is used to test the ball diameter. The invention detects the solder ball diameter, true sphericity, surface quality evaluation, electrostatic treatment, production line introduction verification, Ball shear, etc., and the detection indicators are more systematic and comprehensive. Reduce defects such as unwelded solder joints, jumping balls, voids, and solder joint offsets during the ball planting process, and comprehensively improve the pass rate after ball planting, so that the tested BGA solder balls can be applied to higher-end packaging fields.