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Cooling electronic devices in data center

A technology for data centers and electronic equipment, used in electrical equipment structural parts, heat exchange equipment, lighting and heating equipment, etc., to solve problems such as insufficient cooling and failures

Active Publication Date: 2021-02-12
GOOGLE LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] A consequence of insufficient cooling and / or insufficient cooling may be the failure of one or more electronic devices on the tray due to the temperature of the device exceeding the maximum rated temperature
While some redundancy can be built into computer data centers, server racks, and even individual trays, equipment failure due to overheating can be costly in speed, efficiency, and expense

Method used

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  • Cooling electronic devices in data center
  • Cooling electronic devices in data center
  • Cooling electronic devices in data center

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Embodiment Construction

[0044] In some example embodiments, a cooling system for rack-mounted electronic equipment (eg, servers, processors, storage, network equipment, or others), such as in a data center, is disclosed. In various disclosed embodiments, a cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray enclosure. In some embodiments, a liquid cold plate assembly includes a base and a top that in combination form a cooling liquid flow path through which cooling liquid circulates, and a thermal interface between one or more heat generating devices and the cooling liquid . The top of the liquid cold plate assembly may include multiple inlets and / or multiple outlets to tailor a flow path through which liquid coolant flows to cool electronics in conductive thermal contact with the cold plate assembly.

[0045] figure 1 An exemplary system 100 is illustrated that includes a server rack 105 , such as a 13-inch or 19-inch server rack, and a pl...

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Abstract

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portionmounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquidflow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.

Description

technical field [0001] This document relates to systems and methods for providing cooling to electronic equipment such as computer server racks and related equipment in computer data centers using cold plates. Background technique [0002] Computer users are often concerned with the speed (eg, megahertz and gigahertz) of a computer's microprocessor. A lot of people forget that this speed usually comes at a price - higher power consumption. This power dissipation also generates heat. That's because, according to the simple laws of physics, all energy has to go somewhere, and eventually that somewhere is converted to heat. A pair of microprocessors mounted on a single motherboard can dissipate hundreds of watts or more. Multiply this number by the thousands (or tens of thousands) to account for the many computers in a large data center, and one can easily realize how much heat can be generated. The impact of power drawn by a critical load in a data center is often compound...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20772H05K7/20254G06F1/20G06F2200/201F28F3/022F28F2215/00H01L23/473H05K7/20509
Inventor 马德胡苏丹·克里希南·延加尔克里斯托弗·格雷戈里·马隆李元约尔格·帕迪拉权云星特克久·康诺曼·保罗·约皮
Owner GOOGLE LLC