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Cooling Electronics in Data Centers

A technology for data centers and electronic equipment, which is applied to structural components of electrical equipment, heat exchange equipment, lighting and heating equipment, etc. It can solve problems such as insufficient cooling and failures, and achieve good performance.

Active Publication Date: 2022-04-15
GOOGLE LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] A consequence of insufficient cooling and / or insufficient cooling may be the failure of one or more electronic devices on the tray due to the temperature of the device exceeding the maximum rated temperature
While some redundancy can be built into computer data centers, server racks, and even individual trays, equipment failure due to overheating can be costly in speed, efficiency, and expense

Method used

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  • Cooling Electronics in Data Centers
  • Cooling Electronics in Data Centers
  • Cooling Electronics in Data Centers

Examples

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Embodiment Construction

[0044] In some example embodiments, a cooling system, eg, for rack-mounted electronic equipment (eg, servers, processors, memory, networking equipment, or others) in a data center is disclosed. In various disclosed embodiments, the cooling system may be or include a liquid cold plate assembly, wherein the liquid cold plate assembly is part of or integrated with a server tray enclosure. In some embodiments, a liquid cold plate assembly includes a base and a top that, in combination, form a cooling liquid flow path through which cooling liquid circulates, and a thermal interface between one or more heat generating devices and the cooling liquid . The top of the liquid cold plate assembly may include multiple inlets and / or multiple outlets to customize the flow path through which liquid coolant flows to cool electronic equipment in conductive thermal contact with the cold plate assembly.

[0045] figure 1 An exemplary system 100 is illustrated that includes a server rack 105 , ...

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Abstract

A server tray package includes: a motherboard assembly including a plurality of data center electronics; and a liquid cold plate assembly. a liquid cold plate assembly comprising: a base mounted to a motherboard assembly, the base and motherboard assembly defining a space at least partially surrounding the plurality of data center electronic devices; and a top mounted to the base and including a heat transfer component, The heat transfer member includes a first number of inlet ports and a second number of outlet ports in fluid communication with the cooling liquid flow path defined by the heat transfer member, the inlet ports The first number of is different from the second number of egress ports.

Description

technical field [0001] This document relates to systems and methods for using cold plates to provide cooling to electronic equipment, such as computer server racks and related equipment in computer data centers. Background technique [0002] Computer users are often concerned with the speed of computer microprocessors (eg, megahertz and gigahertz). A lot of people forget that this speed usually comes at a price - higher power consumption. This power consumption also generates heat. That's because, according to the simple laws of physics, all energy has to go somewhere, and eventually that somewhere turns into heat. A pair of microprocessors mounted on a single motherboard can consume hundreds of watts or more. Multiply this number by a few thousand (or tens of thousands) to account for the many computers in a large data center, and one can easily realize how much heat can be generated. When a data center consolidates all the auxiliary equipment needed to support the crit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20772H05K7/20254G06F1/20G06F2200/201F28F3/022F28F2215/00H01L23/473H05K7/20509
Inventor 马德胡苏丹·克里希南·延加尔克里斯托弗·格雷戈里·马隆李元约尔格·帕迪拉权云星特克久·康诺曼·保罗·约皮
Owner GOOGLE LLC