Substrate laminating method and substrate laminating device
A lamination device and substrate technology, applied in lamination devices, chemical instruments and methods, lamination auxiliary operations, etc., can solve the problems of glass substrate wafer position deviation and inability to meet high precision, so as to improve precision and reduce Small influence, effect of improving positional accuracy
Active Publication Date: 2021-02-23
苏州希盟智能装备有限公司
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Problems solved by technology
This substrate lamination method can ensure the positional accuracy when the glass substrate is placed on the wafer, but when the glass substrate is pressed on the wafer, the liquid optical adhesive is squeezed and deformed and flows, and after the lamination is completed, The liquid optical adhesive will flow to a certain extent during the process of standing still, so it will drive the position of the glass substrate relative to the wafer to shift
The glass panel bonded by the substrate bonding method in the prior art has an error of about 0.15mm in the horizontal X direction and horizontal Y direction, and the levelness is about 0.05mm, which cannot meet the high precision requirements of customers.
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[0051] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention.
[0052] In the description of the present invention, unless otherwise expressly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements....
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The invention relates to the technical field of display assembly manufacturing, and discloses a substrate laminating method and a substrate laminating device. The substrate laminating method comprisesthe steps of S1, fixing a first substrate to a carrying table assembly; S2, coating a preset position of the first substrate with glue; S3, pressing a second substrate at a preset position of the first substrate; S4, allowing the first substrate and the second substrate to stand for a preset time so as to flatten the glue; and S5, calibrating the position of the second substrate so as to push thesecond substrate to the preset position of the first substrate again. According to the substrate laminating method, the influence of glue flowing on the laminating relative position of the two substrates can be reduced, and the substrate laminating precision is improved. According to the substrate laminating device, by adopting the substrate laminating method, the laminating position precision ofthe two substrates can be improved.
Description
technical field [0001] The present invention relates to the technical field of display component processing, and in particular, to a substrate bonding method and a substrate bonding device. Background technique [0002] In the production process of the display component, the step of laminating the glass substrate on the wafer through liquid optical glue is included. The process of laminating the glass panel to the wafer in the prior art includes: fixing the wafer on the stage, coating the upper surface of the wafer with liquid optical glue, taking pictures of the wafer and the glass substrate respectively, and according to the photographing information. Compare the results and precisely press the glass panel onto the wafer. This substrate bonding method can ensure the positional accuracy when the glass substrate is placed on the wafer, but when the glass substrate is pressed on the wafer, the liquid optical adhesive is squeezed and deformed and flowed. The liquid optical a...
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Login to View More IPC IPC(8): B32B37/12B32B37/10B32B38/18
CPCB32B37/12B32B37/10B32B38/1841B32B2457/20Y02P70/50
Inventor 殷丹华强华
Owner 苏州希盟智能装备有限公司