Off-line finishing device and finishing method for polishing discs
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
- Publication Date
- 2021-02-26
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Abstract
Description
technical field
[0001] The invention relates to an off-line trimming device and a trimming method of a polishing disc during the polishing process of a large-diameter optical element, in particular to a trimming device and a trimming method of a double-sided polishing machine or a single-axis machine polishing disc. Background technique
[0002] At present, chemical mechanical polishing technology has been widely used to meet the requirements of nano-scale ultra-smooth surface of optical components. Material removal of components and a globally ultra-smooth, damage-free planarized surface. As an important part of the chemical mechanical polishing system, the polishing disc (pad) plays a very important role in the polishing process. As the carrier of abrasives and components, on the one hand, the mechanical properties of the polishing disc, such as elastic modulus, hardness, etc., have an important impact on the deformation and polishing pressure of the polishing disc, and t...