Package and method of forming the same
A technology for packaging and connecting devices, applied in the field of packaging and its formation, can solve problems such as high cost and complex packaging process, and achieve the effect of reducing complexity and manufacturing cost
Active Publication Date: 2021-07-20
SHANGHAI YIBU SEMICON CO LTD
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- Description
- Claims
- Application Information
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Problems solved by technology
The packaging process of traditional stacking technology is more complicated and the cost is higher
Method used
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[0031]The following disclosure provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component on or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which an additional component may be formed between the first component and the second component. components so that the first component and the second component may not be in direct contact with each other. In addition, the present invention may repeat reference numerals and / or characters in various embodiments. This repetition is for the sake of simplicity and clarity and does not in itself indicate a relationship betwee...
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An embodiment of the present invention provides a method for forming a package, the method comprising: placing a first chip layer on a carrier, the first chip layer including a plurality of first chips facing upward; placing and assembling a second chip layer on a chip layer, the second chip layer including a plurality of second chips facing upward and a plurality of chip couplers, wherein the plurality of second chips and the plurality of chips are connected The upper surface of the device has a plurality of first bumps; the first chip layer and the second chip layer are molded above the carrier to form a plastic package structure; and the plastic package structure is thinned , to expose the plurality of first bumps; adding a redistribution layer and a plurality of second bumps over the second chip layer; removing the carrier to form a package body; and dividing the package body to form a plurality of said packages.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a package and a forming method thereof. Background technique [0002] At present, more and more functions are required for semiconductor integrated circuits, and the required calculation speed is getting faster and faster. Under this situation, the industry has begun to increase investment in the research and development of chip stacking technology to explore more efficient solution. However, conventional wafer-level packaging (WLP) technology cannot achieve chip stacking. In the traditional chip stacking technology, stacking is mostly completed in the final assembly, and it is necessary to use through silicon vias (TSV, Through Silicon Via), glass substrate through holes (TGV, Through Glass Via), plastic layer through holes ( TMV, Through MoldVia) or wire bonding (Wire-bond) and other technologies to realize the vertical connection between stacked chips. The packaging ...
Claims
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IPC IPC(8): H01L21/56H01L23/31H01L25/18H01L23/488H01L21/60
CPCH01L25/18H01L23/3128H01L24/02H01L24/11H01L24/13H01L21/56H01L2224/0231H01L2224/02331H01L2224/02381H01L2224/111H01L2224/13008H01L2224/13016H01L25/50H01L25/0652H01L25/0655H01L24/95H01L23/5389H01L24/16H01L2224/95001H01L2225/06517
Inventor 李维平
Owner SHANGHAI YIBU SEMICON CO LTD