Holder for thermally contacting an electronic component and a cooling body

Abstract

The invention provides a holder for thermally contacting an electronic component mounted on a printed circuit board and a cooling body. The holder has a holding body, a spring member, and a tensioningmember. The holding body forms a cavity that corresponds to the electronic component to receive the electronic component. The holder also has a connecting section and a thermally conductive heat conductive section adjacent to the cavity and having a heat conduction function. The heat conduction section is provided with a heat joint surface deviating from the cavity. The tensioning member is configured to tension the spring member. The spring member is designed to be supported on a counter-holding element in a tensioned state and to exert a force on the holding body and / or the component that can be accommodated in the cavity of the holding body, and to move the holding body with the engagement surface towards the cooling body and / or press against the cooling body.

Description

technical field [0001] The invention relates to a holding device for thermally contacting an electronic component mounted on a printed circuit board with a heat sink. Background technique [0002] Electronic components, in particular line electronic components (Leitungselektronik-Bauteil), which are mounted on printed circuit boards and which generate and release heat during operation, generally require cooling. For this reason, it is often necessary to connect such components to a cooling body. [0003] If the radiator is large and heavy or integrally formed with the housing containing the printed circuit board and electronic components, the electronic components are often placed in the housing when the printed circuit board is installed in the housing containing the printed circuit board. Thermally connected to heat sink. [0004] The prior art generally requires the use of several separate components to connect electronic components. Such systems include, for example, ...

AI Technical Summary

Problems solved by technology

[0006] The problem is that since the two installation steps are performed separately, it is possible to forget to install the thermal pad

And since the mounting area of ​​the thermal pad is usually then covered by the printed circuit board, such errors can easily go unnoticed

Although errors can be detected by visual monitoring, this is complex and expensive

[0007] That aside, besides missing the thermal pad entirely, there is no control over whether the part is flush against the thermal pad, or if there is an air bubble between the thermal pad and the part due to a mounting defect or misalignment of the thermal pad or displacement such that the intended surface of the part is not completely against the thermal pad

Since dislocations or displacements are also likely to occur during the mounting of the component to the thermal pad, such flaws cannot or are difficult to detect with visual inspection

[0008] Furthermore, thermal pads are usually standard and the corresponding surfaces of the electronic component and the heat sink facing each other are not necessarily parallel to each other, therefore, known solutions do not mostly compensate for offsets or angles between these surfaces

[0009] And if there is no thermal pad, or if the entire surface of the electronic component is not attached to the thermal pad, the heat can only be insufficiently discharged from the electronic component to the heat sink, which will cause damage to the component during operation

[0010] Since the printed circuit board usually covers the heat sink and the thermal pad, it is impossible or only possible to avoid the above defects by visual monitoring with very complex and costly means

[0011] Furthermore, the mounting sequence may have a negative effect on the heat dissipation process, because in the prior art, the clamping element is often installed last in the housing after the printed circuit board

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