Holder for thermally contacting an electronic component and a cooling body
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- EBM PAPST MULFINGEN GMBH & CO KG
- Publication Date
- 2021-02-26
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Abstract
Description
technical field
[0001] The invention relates to a holding device for thermally contacting an electronic component mounted on a printed circuit board with a heat sink. Background technique
[0002] Electronic components, in particular line electronic components (Leitungselektronik-Bauteil), which are mounted on printed circuit boards and which generate and release heat during operation, generally require cooling. For this reason, it is often necessary to connect such components to a cooling body.
[0003] If the radiator is large and heavy or integrally formed with the housing containing the printed circuit board and electronic components, the electronic components are often placed in the housing when the printed circuit board is installed in the housing containing the printed circuit board. Thermally connected to heat sink.
[0004] The prior art generally requires the use of several separate components to connect electronic components. Such systems include, for example, ...