Semiconductor packages with indications of die-specific information

Abstract

The application relates to semicondcutor packages with indications of die-specific information. Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) an indication positioned in a designated area of the first surface. The indication includes a code presenting information for operating the semiconductor die. The code is configured to be read by an indication scanner coupled to a controller.

Description

technical field [0001] The present technology relates to semiconductor packages with indication of die specific information. More specifically, some embodiments of the inventive technology relate to a semiconductor package having machine readable code thereon indicating information (eg, operating parameters) about a semiconductor die in the semiconductor package. Background technique [0002] Packaged semiconductor die (including memory chips, microprocessor chips, logic chips, and imager chips) typically include the semiconductor die mounted on a substrate and encased in a plastic protective layer. A single semiconductor die may contain functional features, such as memory cells, processor circuits, imager devices, and other circuitry, as well as bond pads electrically connected to the functional features. For example, in order to properly operate a semiconductor die, certain die-specific parameters for operating the semiconductor die, such as current, voltage, resistance r...

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This nonvolatile component can be expensive and unreliable

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