Composition for cured resins, cured product of said composition, method for producing said composition, method for producing said cured product, and semiconductor device
A technology for curing resins and compounds, which is applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve the problem of deterioration of storage stability of sealing resin compositions, inability to obtain moldable reliability and crack-resistant cured products , the reaction cannot be fully carried out, etc., to achieve the effect of excellent fast curing, high reliability, and high glass transition temperature
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Embodiment 1
[0216] A composition for curing resin (hereinafter referred to simply as "composition") and a cured product were prepared as follows, and thermal properties (reaction initiation temperature and reaction peak temperature) were measured by differential scanning calorimetry (DSC) as curability evaluation. ), and glass transition temperature as heat resistance evaluation.
[0217] Components (A1), (B1), (C1) and (D5) were kneaded at atmospheric pressure for 10 minutes on a hot plate with a surface temperature set at 100° C. at the mixing ratio shown in Table 1, and then cooled to room temperature to obtain a mixture. This mixture was pulverized into powder with a mortar to obtain a composition.
[0218]
[0219] Using a differential scanning calorimeter (manufactured by Hitachi High-Tech Science Company: DSC7020), 10 mg of the composition was put into an aluminum alloy under nitrogen flow at a temperature increase rate of 10°C / min and a temperature range from 30°C to 300°C. di...
Embodiment 2～15
[0231] Except having made the compounding ratio of each component into Table 1, it carried out similarly to Example 1, and prepared the composition of each Example. The thermophysical properties (reaction initiation temperature and reaction peak temperature), heat resistance (glass transition temperature) and compatibility of DSC were measured for each composition in the same manner as in Example 1. The results are shown in Table 1.
Embodiment 16
[0237] A curable resin composition (hereinafter, simply referred to as "composition") and a cured product were prepared as follows, and the gel time for curability evaluation and the glass transition temperature for heat resistance evaluation were measured.
[0238] (A1), (B1), (C1), (D5), (E) , carnauba wax, and carbon black were kneaded under atmospheric pressure for 10 minutes according to the compounding ratio shown in Table 2, and then cooled to room temperature to obtain a mixture. This mixture was pulverized into a powder form using Mini Speed Mill MS-09 (manufactured by Labonect Co., Ltd.) so that it could be well filled into a mold to obtain a composition.
[0239]
[0240] According to the gelation time B method (plate method) of JIS K6910 (2007), the composition is placed on a hot plate controlled at 200°C, stirred with a spatula, and the thermal curing reaction is carried out until it cannot be stirred, and the loss of fluidity is measured. The time (seconds) ...
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