Chip packaging structure

Abstract

The invention discloses a chip packaging structure, and the central region of a heat dissipation bonding pad is provided with a sinking groove for the embedding of a chip, thereby forming a cofferdampart in the edge region of the heat dissipation bonding pad, and arranging silver paste layers between the bottom of the sinking groove and the cofferdam part and the lower surface and side wall of the chip. A plurality of heat exchange blind holes extending into the heat dissipation bonding pad are formed in the bottom of the sinking groove; the epoxy insulator is prepared from the following rawmaterials in parts by weight: epoxy resin, linear phenolic resin, liquid nitrile rubber, diethyl pyrocarbonate, silica powder, polyethylene glycol monooctyl phenyl ether, 3aminopropyltriethoxysilane,cellulose acetate butyrate, 5-fluorine-2-methoxyaniline, 2, 4, 6-tri (dimethylaminomethyl) phenol, a release agent and a flame retardant. The chip packaging structure provided by the invention is excellent in heat dissipation effect and mechanical property, and is stable and reliable.

Description

technical field [0001] The invention belongs to the technical field of semiconductor devices, and in particular relates to a chip packaging structure. Background technique [0002] Existing semiconductor chips often use DFN electronic packaging technology, which can allow multiple semiconductor devices to be packaged and connected. Generally, DFN packaging structures do not have pins. Because the DFN package does not have gull-wing leads like the traditional SOIC and TSOP packages, the conductive path between the internal pins and the pad is short, the self-inductance coefficient and the internal wiring resistance of the package are very low, so it can provide excellent electrical performance. And be widely used. Due to the poor fluidity or uneven curing of the epoxy resin composition during the packaging process, it is easy to cause the internal gas to be not completely exhausted and produce air holes, which will lead to moisture absorption of the packaged device and lead ...

AI Technical Summary

Problems solved by technology

Due to the poor fluidity or uneven curing of the epoxy resin composition during the packaging process, it is easy to cause the internal gas to be not completely exhausted and produce air holes, which will lead to moisture absorption of the packaged device and lead to reliability failure, and the generation of internal air holes may also lead to heat conduction Performance degradation resulting in electrical failure or heat loss

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