35 results about "Epoxy insulators" patented technology

A method for providing a corrosion-resistant barrier between bolted dissimilar metals comprising the steps of disposing epoxy adhesive tape on at least one of a first and second metal member, curing the epoxy adhesive tape, applying a corrosion-resistant layer to the first and second metal members, and bolting the first and second metal members together such that the cured epoxy adhesive tape is positioned between the first and second metal members.

The invention discloses a preparation method of a high temperature resistant QFN package structure. The QFN package structure comprises a heat dissipation pad, a chip and conductive pads which are located in an epoxy insulator, wherein the chip is located on the heat dissipation pad, a plurality of conductive pads are disposed around the heat dissipation pad, and the conductive pads and the chip are connected by a lead. The method comprises the following steps of S1, firstly uniformly mixing the silicon micropowder and the flame retardant with gamma-methacryloxypropyltrimethoxysilane for surface treatment; S2, adding epoxy resin, novolac resin, liquid nitrile rubber, diphenylmethane diisocyanate, diethyl pyrocarbonate, dibenzyl phosphate, 5-fluoro-2-methoxyaniline, 2,4,6-tris(dimethylaminomethyl)phenol and a release agent. The preparation method has excellent heat resistance under the premise of ensuring good mechanical properties, and the glass transition temperature reaches 190-230 DEG C, which can meet the requirements of the packaging of high power and high heating chips.

The invention provides a method for preparing an epoxy insulating composite material with improved electrostatic dissipation characteristics, belonging to the technical field of epoxy insulators, comprising spraying a fluorine-containing mold release agent evenly on the inner surface of a mold, putting it into a drying oven to bake and dry, and forming Dense release agent film layer; after taking it out, spray the release agent again outside the dense release agent film layer to form a secondary release agent film layer; pour the epoxy resin mixture into the mold that forms the release agent film layer , let it stand for a certain period of time, until the air bubbles generated by pouring are exhausted; put the mold of pouring epoxy resin mixture into the drying box, solidify according to the temperature gradient, cool to room temperature, demould and sample, and obtain epoxy resin with improved electrostatic dissipation performance. insulator. The present invention introduces fluorine-containing components into the epoxy composite system, and adopts the pretreatment process of secondary spraying of fluorine-containing release agent to form a fluorine-containing permeable layer, which reduces the electrostatic charge accumulation of epoxy resin and improves the surface of epoxy resin. Excellent static dissipation speed, simple and convenient operation, and low cost.

The invention discloses a preparation method of a heat-resistant epoxy resin insulator, which comprises the following steps: performing surface treatment on silicon micropowder with epoxy resin curing agent and gamma-(2,3-epoxy propoxy)propyltrimethoxysilicane; heating the silicon micropowder subjected to surface treatment at 40-50 DEG C for 1-2 hours, and drying for 1-2 hours under the condition of heating to 105-120 DEG C; and then, naturally cooling, mechanically separating bonded silicon micropowder particles, compounding with epoxy resin, and curing to obtain the heat-resistant epoxy resin insulator, wherein the glass transition temperature of the heat-resistant epoxy resin insulator is increased by more than 10 DEG C in comparison with the common epoxy insulator. The invention has the advantages of simple process and mild reaction conditions, and can effectively improve the heat resistance of the epoxy resin insulator. Compared with the conventional silicon micropowder filled epoxy resin composite material, the glass transition temperature of the epoxy resin insulator prepared by the invention is increased by more than 15 DEG C when the silicon micropowder particle content is 30%.

The invention discloses a hoop voltage sensing device. The hoop voltage sensing device comprises an incoming and outgoing line casing pipe, the incoming and outgoing line casing pipe comprises an epoxy insulator, the epoxy insulator is of a hollow structure from top to bottom, a conducting rod is installed in the hollow structure, hoop high-voltage capacitors are installed at the solid portions on the two sides of the part, not the hollow structure, of the epoxy insulator, the hoop high-voltage capacitors are electrically connected with the conducting rod, the adjacent outer side of one of the hoop high-voltage capacitors is provided with a lead end installed in the solid portion of the epoxy insulator, the lead end is provided with an electric lead connected with the hoop high-voltage capacitors, the other end of the electric lead is connected with a low-voltage capacitor device, and the low-voltage capacitor device is connected with a signal processing module connected with a control unit of a switchgear. The hoop voltage sensing device is small in space occupation, influence on electric field distribution in an original environment of an electrical element is small, the measurement precision is high, the temperature and frequency features are good, and the cost is low.