Method for improving discharge resistance of epoxy insulator in gas insulation system

A gas insulation system, epoxy insulation technology, applied in the direction of insulators, circuits, electrical components, etc., can solve the problems of polymer insulation surface degradation or carbonization, indirect economic losses, loss of insulation performance, etc., to achieve good practicability and scope of application Wide, improve the effect of discharge resistance

Active Publication Date: 2017-05-31
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, compared with ceramic and glass insulation, polymer insulation is prone to aging and degradation due to discharge and other factors during use, especially the occurrence of flashover or arc accidents along the surface, which is more likely to cause serious degradation or carbonization of the surface of polymer insulation. Its insulating properties are lost and it has to be replaced
This will not only bring direct economic losses, but also may cause significant indirect economic losses due to power outages

Method used

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  • Method for improving discharge resistance of epoxy insulator in gas insulation system
  • Method for improving discharge resistance of epoxy insulator in gas insulation system
  • Method for improving discharge resistance of epoxy insulator in gas insulation system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Fluorination treatment conditions for epoxy insulation: the temperature of the closed reaction chamber is 55°C, and the pressure is 1bar. The fluorine gas accounts for 12.5% ​​by volume of the reactive mixed gas, and the fluorination treatment time is 30 minutes.

[0034] Resistance to discharge ablation: the specific results are shown in Table 1. The epoxy insulation modified by the fluorination of the surface layer is 2 The average discharge ablation resistance (number of times) in the gas has increased by 11.3 times compared with the non-fluorinated epoxy insulation, and the average DC flashover voltage has increased by 14.1%. 6 The average discharge ablation resistance (number of times) in air is 2.0 times higher than that of non-fluorinated epoxy insulation, while the average AC flashover voltage has no significant change.

Embodiment 2

[0036] Fluorination treatment conditions for epoxy insulation: the temperature of the closed reaction chamber is 25°C, and the pressure is 0.1bar. The fluorine gas accounts for 50% by volume of the reactive mixed gas, and the fluorination treatment time is 4 hours.

[0037] Resistance to discharge ablation: the specific results are shown in Table 1. The epoxy insulation modified by the fluorination of the surface layer is 2 The average discharge ablation resistance (number of times) in the gas has increased by 10.8 times compared with the non-fluorinated epoxy insulation, and the average DC flashover voltage has increased by 5.0%. 6 Compared with the non-fluorinated epoxy insulation, the average discharge ablation resistance (number) in the gas is increased by 1.5 times, while the average AC flashover voltage has no obvious change.

Embodiment 3

[0039] Fluorination treatment conditions for epoxy insulation: the temperature of the closed reaction chamber is 85°C, and the pressure is 1bar. The fluorine gas accounts for 12.5% ​​by volume of the reactive mixed gas, and the fluorination treatment time is 30 minutes.

[0040] Resistance to discharge ablation: the specific results are shown in Table 1. The epoxy insulation modified by the fluorination of the surface layer is 2 The average discharge ablation resistance (number of times) in the gas has increased by 12.0 times compared with the non-fluorinated epoxy insulation, and the average DC flashover voltage has increased by 19.8%. 6 The average discharge ablation resistance (number of times) in air is 2.2 times higher than that of non-fluorinated epoxy insulation, while the average AC flashover voltage has no significant change.

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Abstract

The invention relates to a method for improving the discharge resistance of an epoxy insulator in a gas insulation system. According to the method, fluoridation is carried out on the epoxy insulator by using a gas mixture of fluorine gas and nitrogen gas or a gas mixture of fluorine gas and inert gas under the conditions of appropriate temperature and pressure in a closed reaction chamber, a fluoridation layer containing C-F bonds is formed on the surface of the epoxy insulator, so that the method is used for improving the discharge resistance of the epoxy insulator. Compared with the prior art, the method disclosed by the invention is simple in processing steps, good in controllability and low in economic cost, the epoxy insulators with arbitrary shapes and dimensions can be uniformly modified in batches, and the method is specially applicable for commercial application.

Description

technical field [0001] The invention belongs to the technical field of high-voltage gas insulation, and relates to a method for improving the discharge resistance performance of epoxy insulation in a gas insulation system. Background technique [0002] Polymer insulators have undergone decades of improvement and development in terms of raw materials, formulations and manufacturing processes, and are widely accepted by the market today. In particular, epoxy insulators are not only widely used in outdoor and indoor high-voltage insulation, but also all insulators used in today's closed gas-insulated systems, such as gas-insulated switchgear (GIS) and gas-insulated transmission lines (GIL), are Pot or column epoxy insulators. This is attributed to the fact that polymer insulation has many advantages over traditional ceramic and glass insulation, such as good insulation performance and adaptability, simple manufacturing process, light weight and easy transportation and installa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B17/50H01B19/04
CPCH01B17/50H01B19/04
Inventor 安振连阙龙凯马勇单芳婷
Owner TONGJI UNIV
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