Surge protection device

Abstract

The invention discloses a surge protection device, which comprises a first lead, a second lead and a chip. The ends of the first lead and the second lead and the chip are located in an epoxy insulator. The first lead and the second lead have grooves at the ends thereof. The ends of the first lead and the second lead are respectively and electrically connected with a first metal layer and a secondmetal layer of the chip through soldering lugs. The soldering lugs are embedded into the grooves at the ends of the leads, and the thickness of the soldering lugs is greater than the depth of the grooves. The epoxy insulator includes the following raw materials by weight: 80-100 parts of epoxy resin, 40-60 parts of phenol resin, 75-90 parts of silica micro-powder, 5-15 parts of flame retardant, 2-6 parts of gamma-aminopropyl triethoxysilane, 0.3-2 parts of nano-silica particles, 0.1-1.5 parts of azabicyclo, 0.5-1.5 parts of isooctyl phenyl polyoxyethylene ether, 0.2-1.5 parts of tris-(dimethylaminomethyl)phenol and 3-8 parts of mold release agent. Bad phenomena such as wire tapping, layering and blowhole can be greatly reduced during packaging of the surge protection device, and the packaging yield of the device can be improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor chips, in particular to a surge protection device. Background technique [0002] The surge protection device is a diode used for circuit protection, the English abbreviation is TVS, so it is also called TVS diode. When working, the TVS diode and the protected device are connected in parallel in the circuit. When there is a peak voltage in the circuit, the TVS diode is reversely broken down and turned on, so that the subsequent devices are not subject to high voltage impact, so as to achieve the purpose of protection. [0003] The packaging of TVS diodes is an important factor affecting its performance, and epoxy resin accounts for more than 95% of the packaging materials because of its good physical and mechanical properties and electrical properties, as well as low cost and good reliability. Viscosity has always been an influence An important factor in the encapsulation performance of the ...

AI Technical Summary

Problems solved by technology

[0003] The packaging of TVS diodes is an important factor affecting its performance, and epoxy resin accounts for more than 95% of the packaging materials because of its good physical and mechanical properties and electrical properties, as well as low cost and good reliability. Viscosity has always been an influence An important factor in the encapsulation performance of the epoxy resin composition. In the process of molding, the impact force of the molding compound on the gold wire directly affects the performance of the diode. When the viscosity is high, the gold wire will be deformed and cause a short circuit, thereby reducing the Yield

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