High-stability DFN packaging device
A technology for packaging devices and high stability, which is applied in the direction of electrical solid devices, semiconductor devices, semiconductor/solid device components, etc., and can solve problems such as uneven curing, reduced thermal performance, and poor fluidity of epoxy resin compositions, achieving Package heat dissipation effect is improved, the contact area is increased, and the heat dissipation effect is improved
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[0037] Embodiments 1 to 4: A high-stability DFN packaged device, including a heat dissipation pad 1, a chip 3, and a conductive pad 4 located in an epoxy insulator 6, the chip 3 is located on the heat dissipation pad 1, and is located on the heat dissipation pad 1. Several conductive pads 4 are provided around the disk 1, and the conductive pads 4 and the chip 3 are connected by a lead 5;
[0038] The central area of the heat dissipation pad 1 is provided with a sunken groove 11 for embedding the chip 3, thereby forming a cofferdam portion 12 at the edge area of the heat dissipation pad 1, and the bottom of the sunken groove 11 and the cofferdam portion 12 are in contact with the chip. A silver paste layer 2 is provided between the lower surface and the side wall of the 3, and a number of heat exchange blind holes 13 extending into the heat dissipation pad 1 are opened at the bottom of the sinker 11, and in the heat exchange blind holes 13 It has a silver paste filling par...
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