Preparation method of heat-resistant epoxy resin insulator

A technology for curing epoxy resin and epoxy resin, applied in insulators, electrical components, circuits, etc., can solve problems such as the impact of epoxy insulator performance, reduce mismatch, reduce foreign materials, and increase glass transition temperature. Effect

Inactive Publication Date: 2014-11-05
ZHEJIANG SCI-TECH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the problem that the performance of epoxy insulators filled with silicon micropowder is affected under high temperature conditions, the purpose of the present invention is to provide a method for preparing heat-resistant epoxy resin insulators

Method used

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  • Preparation method of heat-resistant epoxy resin insulator

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Effect test

Embodiment 1

[0024] The γ-(2,3-glycidyloxypropoxy)propyltrimethoxysilane) and the curing agent diaminodiphenylmethane of E-44 bisphenol A type epoxy resin were prepared in a mass ratio of 1:10 After mixing, add a 2% ethanol solution of hydrochloric acid equal to γ-(2,3-glycidyloxypropyltrimethoxysilane) (among them, the concentration of hydrochloric acid used is 37%, and the ethanol used is Anhydrous ethanol, calculated according to the concentration of 2%), after being stirred evenly, it becomes a surface treatment agent, which is added to a container with silicon micropowder particles with a fineness of 1000 meshes for surface treatment. The ratio of differential and surface treatment agent is 1:0.2. After stirring for 20 minutes, heat the surface-treated microsilica powder at a temperature of about 40 degrees for 2 hours, and γ-(2,3-epoxypropoxy)propyltrimethyl Oxysilane) reacts with microsilica powder and curing agent, heats at 120 degrees for 1 hour to remove moisture on the surface o...

Embodiment 2

[0026] The curing agent methyltetrahydrophthalic anhydride of γ-(2,3-glycidyloxypropyltrimethoxysilane) and E-39-D type bisphenol A type epoxy resin is 1 in mass ratio: After mixing at a ratio of 30, add an ethanol solution with a hydrochloric acid content of 2% equal to that of γ-(2,3-glycidyloxypropyltrimethoxysilane) (wherein the concentration of hydrochloric acid used is 37%, The ethanol used is anhydrous ethanol, which is prepared according to the concentration of 2%). After stirring evenly, it becomes a surface treatment agent, which is added to a container with silicon micropowder particles with a fineness of 1000 meshes to treat the silicon micropowder. Surface treatment, wherein the ratio of silicon micropowder to surface treatment agent is 1:0.3. After stirring for 20 minutes, heat the surface treated silicon micropowder at a temperature of about 45 degrees for 1 hour to make γ-(2,3-epoxy Propoxy) Propyltrimethoxysilane) reacts with silicon micropowder and curing age...

Embodiment 3

[0028]The curing agent methyltetrahydrophthalic anhydride of γ-(2,3-glycidyloxypropyltrimethoxysilane) and E-39-D type bisphenol A type epoxy resin is 1 in mass ratio: After mixing at a ratio of 20, add an ethanol solution with a hydrochloric acid content of 2% equal to that of γ-(2,3-glycidyloxypropyltrimethoxysilane) (wherein, the concentration of hydrochloric acid used is 37%, The ethanol used is anhydrous ethanol, which is prepared according to the concentration of 2%). After stirring evenly, it becomes a surface treatment agent, which is added to a container with a fineness of 800 mesh silicon micropowder particles to treat the silicon micropowder. Surface treatment, wherein the ratio of silicon micropowder to surface treatment agent is 1:0.5. After stirring for 20 minutes, heat the surface treated silicon micropowder at a temperature of about 42 degrees for 1.5 hours to make γ-(2,3-epoxy Propoxy) Propyltrimethoxysilane) reacts with silicon micropowder and curing agent me...

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Abstract

The invention discloses a preparation method of a heat-resistant epoxy resin insulator, which comprises the following steps: performing surface treatment on silicon micropowder with epoxy resin curing agent and gamma-(2,3-epoxy propoxy)propyltrimethoxysilicane; heating the silicon micropowder subjected to surface treatment at 40-50 DEG C for 1-2 hours, and drying for 1-2 hours under the condition of heating to 105-120 DEG C; and then, naturally cooling, mechanically separating bonded silicon micropowder particles, compounding with epoxy resin, and curing to obtain the heat-resistant epoxy resin insulator, wherein the glass transition temperature of the heat-resistant epoxy resin insulator is increased by more than 10 DEG C in comparison with the common epoxy insulator. The invention has the advantages of simple process and mild reaction conditions, and can effectively improve the heat resistance of the epoxy resin insulator. Compared with the conventional silicon micropowder filled epoxy resin composite material, the glass transition temperature of the epoxy resin insulator prepared by the invention is increased by more than 15 DEG C when the silicon micropowder particle content is 30%.

Description

technical field [0001] The invention relates to a preparation method of a heat-resistant material, in particular to a preparation method of a heat-resistant epoxy resin insulator. Background technique [0002] Epoxy resin has excellent electrical insulation, chemical stability, corrosion resistance, adhesion and excellent mechanical properties and processability. It is an important class of thermosetting polymer materials. It is used in electrical, chemical, light industry, machinery, It has a wide range of applications in the fields of electronics, water conservancy, transportation, automobiles, construction and aerospace. At present, the annual production capacity of epoxy resin in the world has exceeded 1.5 million tons, and there is a growing trend. With the continuous development of my country's national economy, the scope of application of epoxy resin is also expanding, thus putting forward new requirements for the heat resistance of epoxy resin. The "heat resistance...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B19/00H01B19/04
Inventor 杨洪斌王靖傅雅琴傅维远
Owner ZHEJIANG SCI-TECH UNIV
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