A spray type solder joint gluing device for semiconductor discrete devices

Abstract

The invention provides a semiconductor discrete device jet-type solder spot gluing device, which relates to the technical field of semiconductor discrete devices. The spray-type solder spot gluing device for semiconductor discrete devices includes a shell, and a ventilation pipe is opened on the periphery of the inside of the casing, an air pump is fixedly installed at the bottom of the ventilation pipe, and a ball valve is rotatably connected to the inside of the ventilation pipe. , the front and rear ends of the ball valve are fixedly connected with gears, and the inner side of the ventilation pipe is communicated with a suction pipe. The spray-type solder joint gluing device for semiconductor discrete devices speeds up the efficiency of gluing, avoids the close contact between the nozzle and the circuit board, makes the operation more convenient and will not cause damage to the soldered components, and can control the size of the glue droplets. It is controlled so that it can be better applied to solder joints of different sizes, improves the practicability of the gluing device, avoids the flow of glue, and avoids the waste of glue and the pollution of the circuit board.

Description

technical field [0001] The invention relates to the technical field of semiconductor discrete devices, in particular to a spray type solder joint gluing device for semiconductor discrete devices. Background technique [0002] Semiconductor discrete devices generally refer to semiconductor crystal diodes, semiconductor triodes, referred to as diodes, triodes, and semiconductor special devices. When they are manufactured and used, they need to be soldered to the corresponding circuit boards to obtain components with specific functions. When the welding is completed, in order to improve the stability and good contact effect, it is necessary to glue the solder joints. When the traditional glue device is used, the glue drops freely, the glue efficiency is low, and it needs In close contact with the circuit board, it is easy to touch other components when moving, causing damage and troublesome operation. When gluing, it is easy to cause glue drops to flow, resulting in waste of gl...

AI Technical Summary

Problems solved by technology

[0002] Semiconductor discrete devices generally refer to semiconductor crystal diodes, semiconductor triodes, referred to as diodes, triodes, and semiconductor special devices. When they are manufactured and used, they need to be soldered to the corresponding circuit boards to obtain components with specific functions. When the welding is completed, in order to improve the stability and good contact effect, it is necessary to glue the solder joints. When the traditional glue device is used, the glue drops freely, the glue efficiency is low, and it needs In close contact with the circuit board, it is easy to touch other components when moving, causing damage and troublesome operation. When gluing, it is easy to cause glue drops to flow, resulting in waste of glue and pollution of the circuit board. Moreover, the size of the glue droplet cannot be accurately controlled, so it cannot be applied to solder joints of different sizes, and the practicability is low.

Images