Board card hot plug device and method

Abstract

The invention discloses a board card hot plug device, and the device comprises a main board card; a first processing chip is configured on the main board card, and the first processing chip is electrically connected with a hot plug protection unit, a discharge unit, a voltage detection unit, a first-stage isolation unit and a second-stage isolation unit; the discharge unit and the voltage detection unit are electrically connected with the hot plug protection unit, the primary isolation unit is connected to a first bus, and the secondary isolation unit is connected to a second bus; the first processing chip is electrically connected with the in-place signal end of the hot plug board card; the hot plug board card is configured with a second processing chip, and the second processing chip iselectrically connected with the first processing chip through the first bus; the second processing chip is electrically connected with a main power supply voltage regulator, the hot plug protection unit supplies power to the main power supply voltage regulator and the auxiliary power supply voltage regulator, and the main power supply voltage regulator supplies power to working equipment; and theauxiliary power supply voltage regulator supplies power to the second processing chip.

Description

technical field [0001] The invention relates to the technical field of hot plugging of boards, in particular to a device and method for hot plugging of boards. Background technique [0002] Hot-plugging (hot-plugging or Hot Swap) is hot-plugging. The hot-plugging function allows users to take out and replace damaged hard drives, power supplies or boards and other components without shutting down the system or cutting off the power supply, thereby improving It improves the system's ability to recover from disasters in a timely manner, expandability and flexibility. [0003] With the development of technology and the intensification of computing tasks, the number of switch ports continues to increase, and the scale of switches is getting larger and larger. The single-chip multi-node modular design is more and more applied in the spine layer switch center of the data center. Usually the spine layer The IO boards (line cards) and fan boards in the center of the switch all have ...

AI Technical Summary

Problems solved by technology

Since the hot-swapping is performed when the main board is powered on and working normally, when hot-swapping, there will often be a transient impact current that will affect the main board and the hot-swappable board.

The existing hot-swap power-on and power-on control is often processed in a sequential manner through the control of the delay circuit. In terms of design, the power-on delay circuit of the power-on device can still control the power-on of the following devices, resulting in unstable power-on control, which is prone to The sequence of power on and off is wrong, and there is a risk of leakage

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