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High-yield SMT process for high-quality solder paste printing

A solder paste printing, high yield technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc., can solve problems such as solder paste position overrun, short circuit, solder point bridging, etc., to avoid balling, Effect of improving activity and uniformity and increasing thickness

Pending Publication Date: 2021-03-09
苏州市杰煜科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most common type of defect is that the position of the solder paste exceeds the limit, resulting in bridging of different solder points, which in turn causes a short circuit

Method used

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  • High-yield SMT process for high-quality solder paste printing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] refer to figure 1 As shown, this embodiment discloses a high-yield SMT process for high-quality solder paste printing, including the following steps:

[0047] S1, return to temperature

[0048] a. Take the solder paste out of the refrigerator and quickly place it on the vibrating plate in the reheating box. The initial temperature in the reheating box is the same as that in the refrigerator;

[0049] b. Raise the temperature in the reheating box to 15°C evenly and slowly, and the heating time is 0.5-1H, while keeping the vibration frequency of the vibrating plate at 200-350Hz, and the amplitude does not exceed 0.1mm;

[0050] c. After the temperature reaches 15°C, keep it warm for 1-1.2 hours, while keeping the vibration frequency of the vibrating plate at 500-1000Hz;

[0051] d. Raise the temperature in the reheating box to 50°C evenly and slowly, and the heating time is 0.2-0.5H, while keeping the vibration frequency of the vibrating plate at 200-350Hz, and the ampl...

Embodiment 2

[0066] This embodiment discloses a high-yield SMT process for high-quality solder paste printing, including the following steps:

[0067] S1, return to temperature

[0068] a. Take the solder paste out of the refrigerator and quickly place it on the vibrating plate in the reheating box. The initial temperature in the reheating box is the same as that in the refrigerator;

[0069] b. Raise the temperature in the reheating box to 15°C evenly and slowly, and the heating time is 0.751H, while keeping the vibration frequency of the vibrating plate at 275Hz, and the amplitude does not exceed 0.1mm;

[0070] c. After the temperature reaches 15°C, keep it warm for 1.1H while keeping the vibration frequency of the vibrating plate at 750Hz;

[0071] d. Raise the temperature in the reheating box to 50°C evenly and slowly, and the heating time is 0.35H, while keeping the vibration frequency of the vibrating plate at 275Hz, and the amplitude does not exceed 0.1mm;

[0072] e. After the t...

Embodiment 3

[0086] This embodiment discloses a high-yield SMT process for high-quality solder paste printing, including the following steps:

[0087] S1, return to temperature

[0088] a. Take the solder paste out of the refrigerator and quickly place it on the vibrating plate in the reheating box. The initial temperature in the reheating box is the same as that in the refrigerator;

[0089] b. Raise the temperature in the reheating box to 15°C evenly and slowly, and the heating time is 0.5~1H, while keeping the vibration frequency of the vibrating plate at 200~350Hz, and the amplitude does not exceed 0.1mm;

[0090] c. After the temperature reaches 15°C, keep it warm for 1-1.2 hours, while keeping the vibration frequency of the vibrating plate at 500-1000Hz;

[0091] d. Raise the temperature in the reheating box to 50°C evenly and slowly, and the heating time is 0.2-0.5H, while keeping the vibration frequency of the vibrating plate at 200-350Hz, and the amplitude does not exceed 0.1mm; ...

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Abstract

The invention discloses a high-yield SMT process for high-quality solder paste printing. The high-yield SMT process comprises the following steps that S1, vibration segmented temperature returning; S2, forward and reverse uniform stirring; S3, size reduction and condensation printing; S4, pasting of a pressure monitoring patch; S5, reflow soldering: putting the PCB after surface mounting into a reflow soldering furnace, and performing reflow soldering; and S6, final cleaning and detecting to finish the SMT process. Tin point abnormity can be greatly reduced, and the yield is improved.

Description

technical field [0001] The invention relates to an SMT process, in particular to a high-yield SMT process for high-quality solder paste printing. Background technique [0002] SMT is a common process for assembling PCBs with electronic components. Before attaching the electronic components to the PCB, it is necessary to print solder paste on the corresponding position of the PCB. After reflow soldering, the solder paste will firmly fix the electronic components on the PCB and form a path. Because a variety of electronic components will be attached to a PCB, each electronic component will have at least 2 pins, and there will be dozens or even hundreds of pins, and if any of these pins has a problem, It will cause the entire PCB to be defective. The common calculation methods of defect rate are DPPM and DPMO. The calculation method of DPPM is bad quantity / total production quantity*1000000. The calculation method of DPMO is bad quantity / (total production quantity * total ...

Claims

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Application Information

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IPC IPC(8): H05K3/34H05K13/04
CPCH05K3/341H05K13/0465
Inventor 奚杰
Owner 苏州市杰煜科技有限公司
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