Method for preparing nanoscale welding flux additive through chemical reaction

A chemical reaction and nano-scale technology, applied in the field of welding additives, can solve the problems such as the inability to prepare Sn nanoparticles, and achieve the effects of convenient operation, reduced process requirements, and simple process

Active Publication Date: 2021-03-12
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention is aimed at prior art nanoscale solder additive Cu 6 sn 5 and Cu 3 The problem that Sn nanoparticles cannot be prepared, provides a method for preparing nano-scale solder additives through chemical reactions, that is, by first using reduction reactions to prepare Cu and Sn simple substances, and through dispersion and coordination, Cu and Sn simple substances react to form Cu 3 Sn, and by controlling the reaction temperature and holding time, a mixture containing different nanoparticles can be generated

Method used

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  • Method for preparing nanoscale welding flux additive through chemical reaction

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Embodiment 1

[0020] Embodiment 1: a kind of method for preparing nanoscale solder additive by chemical reaction, concrete steps are as follows:

[0021] (1) CuCl 2 2H 2 O mixed with absolute ethanol to obtain solution A, the SnCl 2 2H 2 O mixed with absolute ethanol to obtain solution B, NaBH 4 Mix with absolute ethanol to obtain solution C; wherein CuCl in solution A 2 2H 2 The concentration of O is 0.150g / mL, the SnCl in solution B 2 2H 2 The concentration of O is 0.125g / mL, NaBH in solution C 4 The concentration of is 0.130g / mL, and the volumes of solution A, solution B and solution C are equal;

[0022] (2) Mix solution A and solution B evenly and raise the temperature to 200°C at a constant speed, then add solution C dropwise to the A-B mixture, shake and react to form a black substance and release a large number of bubbles, shake and react until no bubbles are generated to obtain Seed crystal solution; wherein the drop rate of solution C is 0.05mL / s, and the seed crystals in...

Embodiment 2

[0025] Embodiment 2: a kind of method for preparing nanoscale solder additive by chemical reaction, concrete steps are as follows:

[0026] (1) CuCl 2 2H 2 O mixed with absolute ethanol to obtain solution A, the SnCl 2 2H 2 O mixed with absolute ethanol to obtain solution B, NaBH 4 Mix with absolute ethanol to obtain solution C; wherein CuCl in solution A 2 2H 2 The concentration of O is 0.152g / mL, the SnCl in solution B 2 2H 2 The concentration of O is 0.128g / mL, NaBH in solution C 4 The concentration of is 0.128g / mL, and the volumes of solution A, solution B and solution C are equal;

[0027] (2) Mix solution A and solution B evenly and raise the temperature to 220°C at a constant speed, then add solution C dropwise to the A-B mixture, and shake to form a black substance and release a large number of bubbles, and shake until no bubbles are produced. Seed crystal solution; wherein the drop rate of solution C is 0.07mL / s, and the seed crystals in the seed crystal solu...

Embodiment 3

[0030] Embodiment 3: a kind of method for preparing nanoscale solder additive by chemical reaction, concrete steps are as follows:

[0031] (1) CuCl 2 2H 2 O mixed with absolute ethanol to obtain solution A, the SnCl 2 2H 2 O mixed with absolute ethanol to obtain solution B, NaBH 4 Mix with absolute ethanol to obtain solution C; wherein CuCl in solution A 2 2H 2 The concentration of O is 0.155g / mL, the SnCl in solution B 2 2H 2 The concentration of O is 0.130g / mL, NaBH in solution C 4 The concentration of is 0.135g / mL, and the volumes of solution A, solution B and solution C are equal;

[0032] (2) Mix solution A and solution B evenly and raise the temperature to 180°C at a constant speed, then add solution C dropwise to the A-B mixture, shake and react to form a black substance and release a large number of bubbles, shake and react until no bubbles are generated to obtain Seed crystal solution; wherein the drop rate of solution C is 0.1mL / s, and the seed crystals in ...

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Abstract

The invention relates to a method for preparing a nanoscale welding flux additive through a chemical reaction, and belongs to the technical field of welding additives. The method comprises the following steps that a CuCl2.2H2O/ethanol solution and a SnCl2.2H2O/ethanol solution are uniformly mixed to obtain an A-B mixed solution, a NaBH4/ethanol solution is dropwise added into the A-B mixed solution at 180-220 DEG C, and oscillation reaction is carried out until no bubbles are generated to obtain a seed crystal solution; and the seed crystal solution is subjected to heat preservation at 180-220DEG C and standing for 6-42 hours, solid-liquid separation is carried out, and the solid is washed to obtain the nano Cu3Sn particle additive. According to the method for preparing the nanoscale welding flux additive through the chemical reaction, the stability of welding spots after welding can be improved, the welding performance of current lead-free welding flux is better improved, reliabilityis improved, operation is convenient, and the process is simple.

Description

technical field [0001] The invention relates to a method for preparing nano-scale solder additives through chemical reaction, and belongs to the technical field of welding additives. Background technique [0002] The lead element in traditional Sn-Pb solder is neurotoxic. During the processing of waste electronic devices, lead will seep into the ecological environment and cause indirect pollution. [0003] At present, for lead-free solder, it is generally considered to meet: in electronic packaging, Ag, Cu, Sb, In or other alloying elements are added to the Sn matrix, and the mass fraction of Pb is controlled at 0.2% of the soft solder alloy. lead solder. In recent years, extensive research has been conducted on binary lead-free solder at home and abroad. The systems studied include: Sn-Ag, Sn-Bi, Sn-Sb, Sn-Zn, Sn-In, Sn-Cu and Derived ternary or multi-component solder alloys, etc. With the advancement of technology, the size of electronic devices is getting smaller and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/00C22C9/02B23K35/362B82Y30/00B82Y40/00
CPCB22F9/24C22C9/02B23K35/362B82Y30/00B82Y40/00B22F1/054
Inventor 严继康祖梓翀陇赞陈东东徐凤仙易健宏
Owner KUNMING UNIV OF SCI & TECH
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