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A machine program control method and device

A program control method and program control technology, applied in the direction of program control, electrical program control, comprehensive factory control, etc., can solve problems that need to be improved, and achieve the effect of improving wafer processing efficiency, reducing wafer accumulation, and increasing production capacity

Active Publication Date: 2021-10-26
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] With the complexity of the semiconductor process, Track recipes are also gradually increasing. When these different Track recipes are mixed and run, there are many bottleneck units, which leads to the current production capacity (Wafer Per Hour, WPH) of the machine to be improved.

Method used

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  • A machine program control method and device
  • A machine program control method and device
  • A machine program control method and device

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Embodiment Construction

[0030] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0031] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0032] Secondly, the present invention is described in detail in combination with schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the gener...

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Abstract

The embodiment of the present application discloses a machine program control method and device, which includes determining the bottleneck unit with the longest processing time among the processing units according to the processing time of each processing unit in the machine for each subroutine, and the program of the bottleneck unit Add the first pseudo-subroutine in the program, the first pseudo-subroutine is called before at least one subroutine in the program of the bottleneck unit, when the first pseudo-subroutine is called, the wafer passes through the bottleneck unit without being processed by the bottleneck unit, This is because, in the process of wafer processing by the bottleneck unit, some wafers must pass through the bottleneck unit but do not need to be processed by the bottleneck unit. In the embodiment of the present application, the first dummy subroutine can be added to the program of the bottleneck unit, The stacked wafers can pass through the bottleneck unit, reducing wafer stacking, improving wafer processing efficiency, and increasing the productivity of the entire machine.

Description

technical field [0001] The present application relates to the field of semiconductor device manufacturing, in particular to a machine program control method and device. Background technique [0002] At present, in the semiconductor manufacturing industry, semiconductor manufacturing factories have to produce a wide variety of semiconductor devices in different quantities at the same time, and various types of semiconductor devices have different processing techniques, different processing time periods, and different processing quantities. Various types of semiconductor devices Delivery dates and delivery quantities requested by customers also vary. Under such complex conditions, how to improve the production efficiency of machines has increasingly become the key to the survival and development of semiconductor companies in the fierce competition. [0003] In recent years, the semiconductor manufacturing industry generally requires improvement of management level to minimize...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418
CPCG05B19/41835G05B19/41865Y02P90/02
Inventor 阮厚航李翠阁游凯张鹏真
Owner YANGTZE MEMORY TECH CO LTD