Chip positioning method for semiconductor chip packaging

Abstract

The invention discloses a chip positioning method for semiconductor chip packaging, and the method comprises the following steps: S1, taking a corner point of a chip strip as an initial positioning point, and moving a camera to enable the initial positioning point to appear in a camera view field, S2, calculating the central coordinates of the initial positioning point through an image processingalgorithm, S3, making the camera displace N1 step pitches along the X axis and displace M1 step pitches along the Y axis, S4, calculating the central coordinates of the primary positioning point through an image processing method, S5, making the camera displace N2 steps along the X axis, and calculating the center coordinate of the secondary positioning point, S6, making the camera displace M2 steps along the Y axis, and calculating the center coordinates of the three positioning points, and S7, making the camera displace N2 steps along the X axis, and calculating the center coordinates of thefour positioning points. According to the invention, the four chips far away from the corners are used as positioning reference points, so that the deviation influence of the corner chips in the processes of cutting, turnover and the like is avoided, and the positioning accuracy is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a chip positioning method for semiconductor chip packaging. Background technique [0002] In the packaging process of semiconductor chips, vision positioning technology is one of the core technologies to realize accurate pick-up and transfer of chips. Before the semiconductor chip is packaged, it is necessary to cut the complete chip strip, and then package it after the turnover. This series of processes will easily cause the chips located at the corners to shift. However, the existing positioning methods mostly use the four corners of the chip as a benchmark. When the corners of the chip strips after cutting are offset, positioning with the corner chip as the reference point will cause errors. Offset. [0003] In the packaging process of semiconductor chips, the positioning error allowed by packaging equipment generally does not exceed 0.1mm. Taking the corner chip as t...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of inaccurate or incapable positioning of the existing visual positioning methods in different packaging environments, and select chips far away from the corners as positioning reference points, thereby avoiding the process of cutting and turnover of the chips due to the corners The offset effect generated in the middle, improve the accuracy of positioning

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