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A Chemical Template Method for Copper Surface Roughening

A technology of copper surface and template method, which is applied in the direction of liquid chemical plating, coating, metal material coating process, etc., can solve the problem of uneven roughness, etc., and achieve the effect of simple operation, less time consumption and reduced loss

Active Publication Date: 2022-02-22
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the defect of uneven roughness in the above-mentioned prior art, to provide a simple and reliable chemical template method for roughening the copper surface, and to obtain copper sheets with controllable roughness

Method used

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  • A Chemical Template Method for Copper Surface Roughening
  • A Chemical Template Method for Copper Surface Roughening
  • A Chemical Template Method for Copper Surface Roughening

Examples

Experimental program
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Effect test

Embodiment 1

[0039] ① Preparation of silver ammonia solution: Weigh silver nitrate powder, sorbitol and ammonia water in a beaker according to the mass ratio of 20:10:0.5, and finally set the volume to 1L.

[0040] ②Components of acidic roughening solution: 80mL / L sulfuric acid, 40mL / L hydrogen peroxide, 5g / L sodium chloride, 8g / L tartaric acid.

[0041] ③The components of silver plating stripping solution: 1.5g / L sodium hydroxide, 2mL / L ethylenediaminetetraacetic acid, 0.8mL / L nitric acid, 20mL / L ammonia water, 25mL / L hydrogen peroxide.

[0042] The chemical template method of a kind of roughened copper surface that the present invention proposes, specifically comprises the following steps:

[0043] S1 Generate a template: soak the cleaned copper sheet in a silver ammonia solution at a temperature of 40°C for 1200s to complete the electroless silver plating process, then wash it with deionized water and air-dry it. This step realizes the substitution reaction on the copper surface. The p...

Embodiment 2

[0047] The preparation method and steps are the same as in Example 1, the difference lies in the preparation of the silver ammonia solution: weigh silver nitrate powder, sorbitol and ammonia water in a beaker according to the mass ratio of 0.1:0.001:30, and finally set the volume to 1L.

Embodiment 3

[0049] The preparation method and steps are the same as in Example 1, the difference lies in the preparation of silver ammonia solution: weigh silver nitrate powder, sorbitol and ammonia water in a beaker according to the mass ratio of 10:1:15, and finally set the volume to 1L.

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Abstract

The invention discloses a chemical template method for roughening the copper surface, comprising the following steps: S1 generating a template: soaking the cleaned copper sheet in a silver ammonia solution to obtain a copper sheet with a silver template layer, and the soaking temperature is 0 to 60°C, the soaking time is 5-1200s; S2 roughening treatment: put the sample treated in step S1 into the acid roughening solution for roughening treatment, the roughening temperature is 30-50°C, and the roughening time is 10-600s ; S3 to remove the template: put the sample in step S2 into the stripping solution, and perform template removal treatment to obtain a roughened copper surface. The temperature for removing the template is 40 ° C, and the time is 60 to 180 s; The solution includes a silver salt, an alkaline pH regulator and a stabilizer in a mass ratio of 0.1-20:0.5-30:0.001-10. By adopting the above preparation method, a rough and uniform copper surface is obtained, and the roughness is controllable. It can be applied to the production of circuit boards and surface catalytic materials.

Description

technical field [0001] The invention relates to the field of surface treatment of circuit boards, in particular to a chemical template method for roughening copper surfaces. Background technique [0002] In the increasingly sophisticated and multi-functional multilayer printed circuit board manufacturing process, the improvement of the adhesion between the inner layer copper surface and the resin material has been paid close attention to. Therefore, the copper surface roughening process, which plays a key role in resin lamination, firm bonding of copper layer and dry film, and ink solder mask, also needs to be more efficient and convenient. Commonly used methods for roughening the surface of circuit boards include two chemical oxidation processes, blackening and browning. After the blackening treatment, the copper oxide layer grown on the base copper forms a dendritic structure, thereby promoting the combination of the copper layer and the prepreg, and improving the interla...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44C23F1/18C23F1/40
CPCC23C18/44C23F1/18C23F1/40
Inventor 崔子雅胡光辉李晴王斌潘湛昌
Owner GUANGDONG UNIV OF TECH