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A built-in cooling device based on a loop heat pipe

A technology of heat dissipation device and loop heat pipe, which is applied in the direction of cabinet/cabinet/drawer parts, cooling/ventilation/heating modification, modification with liquid cooling, etc. It can improve the use range and practicability, improve the efficiency of heat dissipation, and improve the use environment.

Active Publication Date: 2022-02-08
泰睿(北京)技术服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The object of the present invention is to provide a built-in cooling device based on a loop heat pipe, to solve the problem that the length of the installation structure of the existing built-in cooling device based on a loop heat pipe in the market is fixed. , when the cooling device is cooling different types of electrical components inside the chassis, it is inconvenient to install with the main body of the chassis, and the existing built-in cooling device based on the loop heat pipe cannot dissipate the heat well Conducted out, so that the emitted heat is around the condenser tube, which affects the cooling efficiency of the later stage

Method used

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  • A built-in cooling device based on a loop heat pipe
  • A built-in cooling device based on a loop heat pipe
  • A built-in cooling device based on a loop heat pipe

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] see Figure 1-6 , the present invention provides a technical solution: a built-in heat dissipation device based on a loop heat pipe, including a chassis shell 1, a heat dissipation port 2, an evaporator 3, a liquid reservoir 4, a steam pipe 5, a condenser pipe 6, a cooling Frame 7, cooling fins 8, liquid co-flow pipe 9, mounting plate 10, through groove 11, vertical rod 12, threaded rod 13, mounting groove 14, bump 15, first adjusting groove 16, second ...

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Abstract

The invention discloses a heat dissipation device built in a case based on a loop heat pipe, which comprises a case case, a heat dissipation port, an evaporator and a liquid storage device. An evaporator is placed inside the evaporator, and the left end of the evaporator is connected to the liquid receiver through a pipe, the right end of the evaporator is connected to the steam pipe through a flange, and the bottom end of the steam pipe is connected to the condenser pipe through a flange The cooling frame is fixed on the outside of the condensation pipe, the left end of the condensation pipe runs through the cooling frame and is connected to the liquid co-flow pipe through a two-way pipe, and the top of the liquid co-flow pipe is connected to the liquid reservoir through a flange. The left ends are connected, and the rear side of the evaporator is fixed with a mounting plate. The built-in cooling device based on the loop heat pipe is provided with a vertical bar and a mounting plate, and the vertical bar can slide in a receiving groove inside the mounting plate, so that the vertical bar can move well.

Description

technical field [0001] The invention relates to the technical field of a built-in cooling device in a chassis, in particular to a built-in cooling device in a chassis based on a loop heat pipe. Background technique [0002] The built-in cooling device of the chassis refers to the general term for the device installed in the chassis and then dissipates heat for the electrical components in the chassis. Some electrical components will be installed in the chassis, and these electrical components will generate a certain amount of heat when they work. If it is high, it will affect the work of these electrical components. The built-in heat dissipation device is installed in the chassis of the computer host or in the chassis of some equipment for heat dissipation, so as to ensure that the temperature in the chassis is normal and avoid the temperature in the chassis being too high and affecting the chassis. The use of electrical components in the chassis, there are various types of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K5/02
CPCH05K7/20409H05K7/20309H05K7/20318H05K5/0213
Inventor 张明放
Owner 泰睿(北京)技术服务有限公司
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