Microelectronic substrate warping measurement method and system based on infrared and optical images

Abstract

The invention belongs to the related technical field of microelectronic substrate warping detection, and discloses a microelectronic substrate warping measurement method and system based on infrared and optical images. The method comprises the following steps: spraying randomly distributed speckles on the surface of a microelectronic substrate; heating the microelectronic substrate, and meanwhilecollecting an infrared image and an optical image of the microelectronic substrate; and carrying out image correlation on the optical image and the original optical image to obtain a displacement strain field, interpolating the infrared image, and then the infrared image having the same resolution as the optical image, thereby obtaining a change relationship between the warping condition of the microelectronic substrate where the speckle is located and the temperature. The deformation condition and the corresponding temperature condition of the microelectronic substrate are obtained by coupling the optical image and the infrared image, the relationship between the deformation amount and the temperature of the microelectronic substrate can be quantitatively obtained, the operation is simple, and the measurement is accurate.

Description

technical field [0001] The invention belongs to the related technical field of microelectronic substrate warpage detection, and more specifically relates to a microelectronic substrate warpage measurement method and system based on infrared and optical images. Background technique [0002] The temperature change during the microelectronic chip packaging process will cause the microelectronic substrate to warp and deform. In addition, the packaged chip will also experience heat warping and deformation under working conditions, and even expansion and delamination. The preparation of the microelectronic substrate and the substrate The reliability of the mounted electronic devices has a major impact. The conventional detection methods are observation method, feeler gauge measurement, etc., which are inefficient and have false detections. [0003] Chinese patent CN208606731U discloses a substrate warpage detection device, which is provided with four sensors located at four corner...

AI Technical Summary

Problems solved by technology

The rough inspection of the adjustment lever will leave scratches on the surface of the substrate. In the fine inspection, it can only judge whether the warpage is qualified, but it cannot match the warpage with the specific position.

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