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Photosensitive insulating paste and electronic component

A technology of electronic components and insulating paste, which is applied in the field of photosensitive insulating paste and electronic components, can solve the problems of hindering light transmission and inability to obtain high resolution, and achieve the effect of high resolution

Pending Publication Date: 2021-03-30
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the other hand, a method of suppressing the light transmittance after firing by mixing light-shielding inorganic fillers in the photosensitive paste is considered, but there is a problem that the light transmittance is also hindered during photolithographic patterning of the photosensitive paste, and high resolution cannot be obtained. rate problem

Method used

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  • Photosensitive insulating paste and electronic component
  • Photosensitive insulating paste and electronic component
  • Photosensitive insulating paste and electronic component

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Experimental program
Comparison scheme
Effect test

experiment example

[0134] Next, in order to confirm the effect of the above-mentioned photosensitive insulating paste of the present invention, a coil electronic component was produced using the photosensitive insulating paste, and the appearance of the coil electronic component was evaluated, the crack generation load was evaluated, and the compactness inside the coil electronic component was evaluated. and experiments to determine resolution (aspect ratio).

[0135] (1) Specifications of samples

[0136] The specifications of the samples used in this experiment are as follows.

[0137] ・For the dimensions (design values) of the coil electronic parts, the L dimension is 0.4mm, the W dimension is 0.2mm, and the T dimension is 0.2mm.

[0138] - Composition of the insulating layer: Glass (glass frit), the first inorganic filler, and the second inorganic filler were the composition ratios described in Table 1. The glass (glass frit) is borosilicate glass, the first inorganic filler is alumina, an...

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Abstract

Provided are: a photosensitive insulating paste which has a high resolution before calcination and is capable of suppressing both light transmission and cracks after calcination; and an electronic component using the photosensitive insulating paste. The photosensitive insulating paste contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower. The electronic component according to preferred embodiments of the present disclosure is produced by using the photosensitive insulating paste.

Description

technical field [0001] The present invention relates to photosensitive insulating paste and electronic parts. Background technique [0002] Conventionally, JP 2012-246176 A has been disclosed as a photosensitive paste used in electronic components (Patent Document 1). This photosensitive paste is characterized by using glass powder having a specific composition in order to improve the compactness after firing and chemical resistance. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2012-246176 Contents of the invention [0004] However, when this photosensitive paste is used for the insulating layer of an electronic component, the light transmittance also becomes high in the insulating layer after firing, and if the thickness between the internal electrode layer and the surface of the electronic component is thin, it can be transmitted through the surface of the electronic component. When the internal electrode layer is seen, it is difficult to distinguish forei...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/033G03F7/004H01F17/00H01F27/28H01F27/32
CPCG03F7/033G03F7/004H01F17/0013H01F27/2804H01F27/324H01F2027/2809G03F7/0047G03F7/027C03C8/16C03C8/20H05K3/0023H05K1/0306H05K3/4667G03F7/028
Inventor 近藤健太田边新平
Owner MURATA MFG CO LTD