Processing equipment for crimping insulating film on electronic lead

A technology of insulating film and processing equipment, applied in the direction of transformer/inductor coil/winding/connection, transformer/inductor parts, inductor/transformer/magnet manufacturing, etc., which can solve the problem of low safety factor and poor versatility, etc. problems, to achieve the effect of improving the safety factor, solving the poor versatility, and improving the effect of crimping

Inactive Publication Date: 2021-04-02
HANGZHOU KUANFU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is: in order to solve the problem of low safety factor and poor versatility of the existing processing equipment for crimping insulating films on electronic leads, the present invention provides a processing equipment for crimping insulating films on electronic leads

Method used

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  • Processing equipment for crimping insulating film on electronic lead
  • Processing equipment for crimping insulating film on electronic lead
  • Processing equipment for crimping insulating film on electronic lead

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] see figure 1 and 2 , a processing device for crimping insulating films on electronic leads, comprising a workbench 1, a high-frequency machine pressing die 11 and a control pedal 12, a sliding mechanism 2 is provided in the middle of the top of the workbench 1, and the sliding mechanism 2 includes a sliding track 21. The main slider 22, the bearing plate 23 and two sliding handrails 24, the sliding track 21 is set in the middle of the top of the workbench 1, the main slider 22 is slidably connected to the inside of the sliding track 21, and the bearing plate 23 is fixedly connected to the bearing plate 23, two sliding handrails 24 are fixedly connected to the both sides of the load plate 23, both sides of the sliding track 21 are provided with limiting guide rails 27, and the two ends of the limiting guide rails 27 are fixedly connected with auxiliary brackets 26, auxiliary brackets 26 The bottom of the bearing plate 23 is fixedly connected with the workbench 1, and th...

Embodiment 2

[0034] see figure 1 , 4 and 5, the present embodiment is further optimized on the basis of embodiment 1, specifically, two positioning mechanisms 3 are provided between the carrying plate 23 and the workbench 1, and the positioning mechanisms 3 include a positioning box 31, a pressure Spring 32, top plate 33, round head positioning pin 34 and positioning groove 36, positioning box 31 are fixedly connected on the top of workbench 1, pressure spring 32, top plate 33 and round head positioning pin 34 are all positioned at the inside of positioning box 31, The positioning slot 36 is defined at the bottom of the supporting board 23 .

[0035] Specifically, the top plate 33 is slidably connected to the positioning box body 31 , and the pressure spring 32 is fixedly connected between the top plate 33 and the inner cavity bottom of the positioning box body 31 .

[0036] Specifically, a packaging board 35 is fixedly connected to the top of the positioning box 31 .

[0037] Specifica...

Embodiment 3

[0040] see figure 1 and 3 , the present embodiment is optimized as follows on the basis of example 1 or example 2, specifically, the top of the carrying plate 23 is provided with a quick release module 4, and the quick release module 4 includes a module mounting plate 41, a double wire mold Group 42, three-wire module 43, four-wire module 44 and two fixing screws 45, two-wire module 42, three-wire module 43 and four-wire module 44 are all fixedly connected to the top of module mounting plate 41.

[0041] Specifically, the module mounting plate 41 is slidably connected to the carrying plate 23 , and the fixing screws 45 pass through the module mounting plate 41 and are screwed to the carrying plate 23 .

[0042] Specifically, the two-wire module 42 is fixedly connected to the top middle of the module mounting plate 41 , and the three-wire module 43 and the four-wire module 44 are respectively located on both sides of the two-wire module 42 .

[0043] In this embodiment, a two-w...

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Abstract

The invention discloses processing equipment for crimping an insulating film on an electronic lead, and relates to the technical field of electronic component processing equipment. The processing equipment comprises a workbench, a high-frequency machine pressing die and a control pedal, wherein a sliding mechanism is arranged in the middle of the top end of the workbench, and the sliding mechanismcomprises a sliding rail, a main sliding block, a bearing plate and two sliding armrests; the sliding rail is arranged in the middle of the top end of the workbench, the main sliding block is connected into the sliding rail in a sliding mode, the bearing plate is fixedly connected to the top of the bearing plate, the two sliding armrests are fixedly connected to the two sides of the bearing plate, and two positioning mechanisms are arranged between the bearing plate and the workbench. According to the equipment, through the arrangement of the sliding mechanism, a problem that the existing processing equipment for crimping the insulating film on the electronic lead is not high in safety coefficient is solved, and through the arrangement of the quick release module, a problem that the existing processing equipment for crimping the insulating film on the electronic lead is poor in universality is solved.

Description

technical field [0001] The invention relates to the technical field of processing equipment for electronic components, in particular to a processing equipment for crimping an insulating film on an electronic lead. Background technique [0002] One end of the primary or secondary electronic leads used in electronic transformers needs to be crimped with galvanized copper terminals and put on a plastic shell. The existing processing method is to use a high-frequency machine for packaging. Because the high-frequency machine will generate electric sparks when it is working, When the operator is close, the operator will be burned, the safety factor is not high, and the electronic lead wire has specifications such as two-wire, three-wire and four-wire, etc. The existing processing equipment mostly uses fixed mold groups, which is not universal. . [0003] In Chinese patent application number: CN200920062449.5, there is disclosed a processing equipment for crimping insulating films...

Claims

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Application Information

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IPC IPC(8): H01F41/12H01F27/29H01F27/32
CPCH01F27/29H01F27/324H01F41/125
Inventor 戚亮亮
Owner HANGZHOU KUANFU TECH
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