Electroplating support plate for ultrathin circuit board, electroplating system and electroplating method
A circuit board and support board technology, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problem of bending and breaking at the pinch point between the circuit board and the fixture, the weight of the ultra-thin circuit board cannot be dropped vertically, the tank body, the anode Avoid problems such as baffle contact and collision, so as to avoid uneven thickness of the electroplating layer, ensure the quality of electroplating, and reduce the scrap rate
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[0040]Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.
[0041]It should be noted that the component is referred to as "fixed to" another component, which can be directly in another component or may also exist. When a component is considered to be "connected" another component, it can be directly connected to another component or may exist at the same time. When a component is considered "set to" another component, it can be directly set on another component or may exist at the same time. The terms "vertical", "horizontal", "left", "right", and similar expressions are merely for illust...
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