Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of circuit board electroplating method

A technology for circuit boards and circuit boards, which is applied in the manufacture of printed circuits, electrical components, and printed circuits. It can solve the problems of difficult adjustment of clamp distance, influence on production efficiency, and poor fixation, so as to achieve good clamping effect and improve work efficiency. , the effect of good adjustment ability

Active Publication Date: 2021-12-17
徐州里程碑智能科技有限公司
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of circuit board electroplating method, to solve the existing circuit board electroplating method proposed in the above-mentioned background technology needs to fix the circuit board on the electroplating equipment, when the existing electroplating equipment circuit board needs to pass The fixture is fixed, and the position of the existing fixture is generally fixed. When the size of the circuit board is different, the distance between the fixtures is difficult to adjust, resulting in poor fixation. Problems affecting productivity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of circuit board electroplating method
  • A kind of circuit board electroplating method
  • A kind of circuit board electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0024] see Figure 1 to Figure 9 , an embodiment provided by the present invention:

[0025] A circuit board electroplating method, the circuit board electroplating method is completed based on circuit board electroplating equipment, and then realize the electroplating of circuit boards; the circuit board electroplating equipment includes an upper mounting base 1; the bottom of the upper mounting base 1 is provided with Four pairs of adjusting connecting rods 2; the bottoms of the four pairs of adjusting connecting rods 2 are jointly connected with a group of lower mounting bases 3; the bottom of the lower mounting base 3 is slidingly connected with five groups of sl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a circuit board electroplating method. The circuit board electroplating method is completed based on circuit board electroplating equipment, and further realizes circuit board electroplating; the circuit board electroplating equipment includes an upper mounting seat; the upper mounting seat Four pairs of adjusting connecting rods are arranged at the bottom of the bottom; the bottoms of the four pairs of adjusting connecting rods are jointly connected with a group of lower mounting seats. The invention has good adjustment ability and stronger adaptability, and the clamping effect of the circuit board is better. At the same time, the synchronous pressing of five groups of active clamping blocks can be realized by rotating the clamping operation part, which reduces the operation and improves the work efficiency.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board electroplating method. Background technique [0002] An important step in the process of circuit board production is electroplating. The principle of electroplating is to electroplate a layer of metal or form an alloy on the surface of other metals. It mainly uses the effect of electrolysis to form the same oxidized metal film on the metal surface or non-metal surface, so as to prevent oxidation, reflect light, and resist corrosion (copper sulfate, etc.). [0003] For example, the application number: CN200910310544.7 The present invention provides an ultra-thin magnetic-fixed printed circuit board electroplating fixture, which is used to clamp the printed circuit board. The printed circuit board electroplating includes a first clamping portion, the first clamping portion includes a main body and a clamping cover, the main body includes a first m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18
CPCH05K3/187
Inventor 刘明
Owner 徐州里程碑智能科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com