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Electronic component processing and positioning mold

A technology for positioning molds and electronic components, applied in manufacturing tools, workbenches, workpiece clamping devices, etc., can solve the problems of inconvenient removal of electronic components, affecting the cleanliness of the surface of the processing table, reducing functionality, etc., to improve practicability and workability. Efficiency, improved protection and practicality, improved functionality

Pending Publication Date: 2021-04-16
昆山新富星电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, the positioning mold for electronic component processing has no protective function, it only limits the position of the electronic component. When the electronic component is placed inside the positioning mold, the four corners are not protected, which will cause the corners of the electronic component to be damaged by friction, resulting in It affects the use and reduces the processing quality; and the existing electronic component processing positioning mold is inconvenient to use. After the electronic component is processed, it is not convenient to take out the electronic component, resulting in a decrease in processing efficiency and reduced practicability; and the existing The positioning mold for electronic component processing has no waste storage function. When electronic components are processed, the waste and garbage generated are accumulated on the processing table, which affects the cleanliness of the processing table surface and reduces its functionality.

Method used

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  • Electronic component processing and positioning mold
  • Electronic component processing and positioning mold
  • Electronic component processing and positioning mold

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1~4 , in an embodiment of the present invention, an electronic component processing and positioning mold includes a processing table 1 and a storage box 9, a plurality of support columns 11 are installed at the lower end of the processing table 1, a sliding seat 2 is installed in the middle of the upper end of the processing table 1, and the sliding seat 2 The upper end is provided with a chute 21, the right end wall of the slide seat 2 is p...

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Abstract

The invention discloses an electronic component processing positioning mold in the field of electronic components. The electronic component processing positioning mold comprises a processing table and a storage box, wherein a plurality of supporting columns are mounted at the lower end of the processing table, a sliding seat is mounted in the middle of the upper end of the processing table, a sliding groove is formed in the upper end of the sliding seat, a convex box is arranged on the right end wall of the sliding seat, a placing cavity is formed in the upper end of the convex box, and a positioning mold is mounted at the upper end of the sliding seat; through holes are formed in the left side wall and the right side wall in the positioning mold, pin blocks are mounted in the two through holes, pull rings are fixedly connected to the outer ends of the two pin blocks, a supporting plate is mounted on the right side of the rear end wall of the positioning mold, a protruding block is arranged at the lower end of the positioning mold, and a pulley is mounted at the lower end of the protruding block; a protection pad is installed at four corners in the positioning mold through screws and is made of an anti-static material, so that after an electronic element is placed in the positioning mold, the protection pad protects the four corners of a electronic element body, the situations that the four corners are damaged due to friction and use is affected are avoided, and protection performance and practicability of the electronic element body are improved.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a positioning mold for processing electronic components. Background technique [0002] Electronic components are the basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions, such as: amplifiers, radio receivers , oscillators, etc., one of the common ways to connect electronic components is soldering to a printed circuit board. Electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.), or various complexity Groups, for example: integrated circuits (operational amplifiers, resistors, logic gates, etc.). [0003] In the existing technology, the positioning mold for electronic component processing has no protective function, it only limits the position of the el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25H1/00B25H1/12B25H1/08B25B11/00
Inventor 肖文森
Owner 昆山新富星电子科技有限公司