Energy-saving and environment-friendly scraping and grinding device for copper-clad board surface of integrated circuit board

Abstract

The invention relates to the technical field of processing of integrated circuit boards, in particular to an energy-saving and environment-friendly scraping and grinding device for a copper-clad board surface of an integrated circuit board. First springs are fixedly connected to the inner walls of the two sides of a grinding frame, and air bag boxes are fixedly connected to the outer surfaces of supporting legs. Groove plates are fixedly connected to the outer surfaces of the supporting legs and located above the air bag boxes, limiting plates are fixedly connected to the inner wall of the grinding frame and located above the groove plates, pressing plates are fixedly connected to the bottom ends of the limiting plates, and sliding plates are fixedly connected to the bottom ends of the pressing plates and penetrate through the interiors of the air bag boxes. Air bags are fixedly connected to the bottom ends of the sliding plates and located in the air bag boxes, rotating wheels rotate to drive electric contact rods to move and are not connected with the input ends of rotating shafts any more, grinding blocks cannot continue to conduct grinding, the inclined grinding condition of the grinding blocks can be avoided, therefore, the thin copper-clad surface is prevented from being ground and damaged, and waste of circuit boards is prevented.

Description

technical field [0001] The invention relates to the technical field of integrated circuit board processing, in particular to an energy-saving and environment-friendly scraping device for the copper-clad surface of an integrated circuit board. Background technique [0002] In the production and manufacturing process of integrated circuit boards, it is necessary to print out the drawn circuit boards with transfer paper, and use fine sandpaper to polish off the oxide layer on the surface of the copper clad laminates to ensure that the circuit boards are transferred to facilitate thermal transfer printing. The toner on the paper can be firmly printed on the copper clad board. The standard of polishing is that the board surface is bright and there is no obvious stain. [0003] The copper layer on the surface of the copper-clad laminate of the integrated circuit board is thin. If the copper layer is worn off during the grinding process, the copper layer will be worn off, resulting...

AI Technical Summary

Problems solved by technology

[0003] The copper layer on the surface of the copper-clad laminate of the integrated circuit board is thin. If the copper layer is worn off during the grinding process with excessive force, the circuit board will be scrapped and materials will be wasted, thereby increasing the production cost, and the grinding of the circuit boards is usually carried out manually one by one. Grinding is time-consuming and labor-intensive, and the production efficiency is low. Therefore, those skilled in the art provide an energy-saving and environment-friendly scraping device for the copper-clad surface of integrated circuit boards to solve the problems raised in the above-mentioned background technology

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