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Highly transparent and low-expansion polyimide film containing benzimidazole structure and preparation method thereof

A technology of polyimide film and benzimidazole, which is applied in the field of high-transparency and low-expansion polyimide film and its preparation, can solve the problems of unresearched light transmittance, thermoplastic low thermal expansion coefficient, etc., and promote localization Development, low heat resistance, low thermal expansion coefficient effect

Active Publication Date: 2022-05-13
SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Zhou Yu et al. used a diamine monomer containing benzimidazole groups, 2-(3-aminophenyl) 5-aminobenzimidazole, to perform polycondensation reaction with dianhydride monomers to obtain a series of polyimide films. It has high heat resistance and good mechanical properties. At the same time, the relative position of the amino group in the diamine monomer endows the molecular chain with high flexibility, so that this type of polyimide has good thermoplasticity and low thermal expansion. Coefficient, CTE can reach 7.9ppm / K, but light transmission has not been studied

Method used

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  • Highly transparent and low-expansion polyimide film containing benzimidazole structure and preparation method thereof
  • Highly transparent and low-expansion polyimide film containing benzimidazole structure and preparation method thereof
  • Highly transparent and low-expansion polyimide film containing benzimidazole structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Prepare high transparency and low expansion polyimide film according to the following method:

[0039](1) Under the protection of nitrogen, add 4.84g of benzimidazole diamine monomer HBP-BI and 42.49g of DMAc into a four-necked flask. After completely dissolving, add 4.4868g of dianhydride monomer 6FDA in batches. Stirring at 35° C. for 8 hours to obtain a polyamic acid solution through polycondensation reaction;

[0040] (2) Add catalyst triethylamine 4.5536g and dehydrating agent acetic anhydride 4.5941g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0041] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 120° C. for 24 hours to obtain a highly transparent and low-expansion polyimide film.

[0042] (4) The properties of the obtained polyimide film were characterized. The light transmittance at 380nm-780nm was 87%, the yellowness index was 1.27, the therm...

Embodiment 2

[0044] Prepare high transparency and low expansion polyimide film according to the following method:

[0045] (1) Under the protection of nitrogen, add 2.42g of benzimidazole diamine monomer HBP-BI, 1.6012g of TFMB (the ratio of HBP-BI and TFMB is 1:1) and 38.76g of DMAc into a four-necked flask, and after completely dissolving , add 4.4868g dianhydride monomer 6FDA in batches, stir at 35°C for 8h, and obtain polyamic acid solution through polycondensation reaction;

[0046] (2) Add catalyst triethylamine 4.5536g and dehydrating agent acetic anhydride 4.5941g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0047] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 120° C. for 24 hours to obtain a highly transparent and low-expansion polyimide film.

[0048] (4) The properties of the obtained polyimide film were characterized. The light transmittance at 380nm-780nm wa...

Embodiment 3

[0050] Prepare high transparency and low expansion polyimide film according to the following method:

[0051] (1) Under the protection of nitrogen, add 3.872g of benzimidazole diamine monomer HBP-BI, 0.6405g of TFMB (the ratio of HBP-BI and TFMB is 8:2) and 38.76g of DMAc into a four-necked flask, and after completely dissolving , add 4.4868g dianhydride monomer 6FDA in batches, stir at 35°C for 8h, and obtain polyamic acid solution through polycondensation reaction;

[0052] (2) Add catalyst triethylamine 4.5536g and dehydrating agent acetic anhydride 4.5941g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0053] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 120° C. for 24 hours to obtain a highly transparent and low-expansion polyimide film.

[0054] (4) The properties of the obtained polyimide film were characterized. The light transmittance at 380nm-780nm w...

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Abstract

The invention specifically relates to a highly transparent and low-expansion polyimide film containing a benzimidazole structure and a preparation method thereof, belonging to the technical field of polyimide modification. According to the highly transparent and low-expansion polyimide film containing benzimidazole structure in the present invention, the general structural formula of the polyimide is: m and n are both positive integers of 50-200. The highly transparent and low-expansion polyimide film containing benzimidazole structure described in the present invention has good light transmittance, low expansion coefficient and excellent heat resistance; meanwhile, the present invention provides a simple and easy line of preparation.

Description

technical field [0001] The invention specifically relates to a highly transparent and low-expansion polyimide film containing a benzimidazole structure and a preparation method thereof, belonging to the technical field of polyimide modification. Background technique [0002] With the continuous expansion of the smart electronic product market and the development of flat panel display technology, ultra-thin, ultra-light, foldable and rollable flexible display technology will become the standard configuration of a new generation of electronic products. In addition to transparency and heat resistance, flexible display devices require polymer materials to have good dimensional stability, flexibility, excellent solvent resistance, and a simple film-forming process. Polyimide has the characteristics of high temperature resistance, high strength, and corrosion resistance, which can meet the high temperature resistance requirements in the process of optoelectronic device processing,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1067C08G73/1039C08G73/1071C08G73/1078C08G73/1007C08J5/18C08J2379/08
Inventor 王汉利顾萍王俊莉杨振东单体美
Owner SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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