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Chip bonding pad structure of PCB

A chip pad, PCB board technology, applied in the direction of electrical connection of printed components, printed circuit components, electrical components, etc., can solve the problems of reducing the line width and the distance between the pads, etc., to ensure the yield and continuous wiring. The effect of impedance

Inactive Publication Date: 2021-05-04
GUANGZHOU LANGO ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a chip pad structure of a PCB board, which can solve a series of problems caused by the small distance between the pads and the need to reduce the line width in the prior art

Method used

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  • Chip bonding pad structure of PCB
  • Chip bonding pad structure of PCB
  • Chip bonding pad structure of PCB

Examples

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Effect test

Embodiment 1

[0015] The chip pad structure of the PCB board of the present embodiment, as figure 2 As shown, several chip pads are included, and several chip pads are arranged in m rows and n columns. Each chip pad is elliptical, and the elliptical chip pads are arranged in rows and columns, and all the elliptical chip pads have the same long axis direction and the same short axis direction. The position between the minor axis and the minor axis is used for routing.

[0016] Such as image 3 As shown, a is defined as the major axis of the ellipse, and b is defined as the minor axis of the ellipse.

[0017] The consistent interpretation of the direction of the major axes of the ellipses means that the major axes of each ellipse are in the direction of the X axis, or they are all in the direction of the Y axis. The same is true for the direction of the minor axis.

[0018] In the chip pad of the present invention, by changing the circular pad into an ellipse with an equal area, the area...

Embodiment 2

[0020] The chip pad structure of the PCB board of the present embodiment, as Figure 4 As shown, several chip pads are included, and several chip pads are arranged in m rows and n columns. Each chip pad is rectangular, and the rectangular chip pads are arranged in rows and columns, and all rectangular chip pads have the same length direction and the same width direction. The position between width and width is used for wiring.

[0021] The direction of the length of the rectangles is consistently interpreted as: the length of each rectangle is in the direction of the X-axis, or in the direction of the Y-axis. Same goes for the width direction.

[0022] For the chip pad of this embodiment, by changing the circular pad into a rectangle with the same area, the area of ​​the pad does not change, but the shape changes. The area does not change to ensure that the same area of ​​the PCB board can accommodate the same number of BGA (BallGrid Array, ball grid array package) balls, w...

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Abstract

The invention provides a chip bonding pad structure of a PCB. According to the bonding pad structure of the PCB, a circular chip bonding pad in the prior art is changed into an oval or rectangular chip bonding pad; on the premise that the area of the chip bonding pad is kept unchanged, a distance between bonding pads not needing wiring is sacrificed, and a distance between the bonding pads needing wiring is increased; and normal wiring can be realized without reducing line width, and continuous wiring impedance is obtained. A manufacturer with a poor PCB production process can perform normal production, so the yield of the PCB is ensured.

Description

technical field [0001] The invention relates to the technical field of pads of PCB boards, in particular to a pad structure of PCB boards. Background technique [0002] In the prior art, the chip pads of the PCB board are all circular, such as figure 1 shown. When wiring a PCB, it is usually necessary to route wires between pads. Originally, the distance between the pad and the pad is very small. If the wire is routed between the pad and the pad, the distance between the chip pad and the line will be smaller, which conflicts with the PCB design rules. When BGA packaged devices with small pads go out, because the spacing between chip pads is too small, the general production process can only achieve a minimum trace width of 4mil. However, it is not possible to allow traces with a width of 4mil between pads with a small pitch. In this case, the trace width has to be reduced to 3.5mil, which increases the difficulty of the production process. At the same time, after using 3...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/111H05K2201/094
Inventor 陈刚张春洪飞龙
Owner GUANGZHOU LANGO ELECTRONICS TECH CO LTD
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