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Preparation method of circuit board and circuit board

A technology for circuit boards and air-permeable boards, which is used in printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of incomplete plug holes, circuit board deformation, and plug hole blisters, so as to achieve full plug holes, ensure smoothness, The effect of plug hole leveling

Active Publication Date: 2021-05-04
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The general tools for resin plug hole production include plug hole aluminum sheet screen, breathable plate and scraper. The scraper squeezes and scrapes the resin into the hole to make it full, but the breathable plate is needed to give air flow space, so the breathable plate is the resin plugging process. A necessary auxiliary tool, but during the drilling process of the existing air-permeable board, the slightly denser parts will fall off and form holes. The larger these holes are, the circuit board will be deformed when using a scraper to make resin plug holes. The problem gets worse, leading to problems with plug holes, underfilled plug holes, and plug hole blistering

Method used

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  • Preparation method of circuit board and circuit board
  • Preparation method of circuit board and circuit board

Examples

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preparation example Construction

[0035] The application provides a method for preparing a circuit board. The method for preparing the circuit board includes the following steps: making a ventilating board, and setting an island area on the venting board; placing a circuit board with holes to be plugged on the venting board, and The circuit board to be plugged is abutted against the island area; the aluminum sheet is bonded to the bottom layer of the screen to obtain an aluminum mesh with windows; the aluminum mesh is placed on the circuit board to be plugged ; The window is set facing the hole to be plugged, and the hole to be plugged is set right against the air guide between the island areas; the copper paste covered on the aluminum mesh is scraped to the window In the process, the copper paste is poured into the hole to be plugged through the window; the resin plug is inserted into the hole to be plugged in the circuit board through the aluminum mesh; the copper paste in the circuit board is Carry out curi...

Embodiment 1

[0095] Select a breathable plate with a thickness of 2.0mm, and the length of the breathable plate is 30mm larger than the circuit board to be plugged, and the width of the breathable plate is 30mm larger than the circuit board to be plugged. Controlled depth drilling is performed on the air-permeable board to obtain an island area on the air-permeable board. Place the circuit board with holes to be plugged on the air-permeable board, so that the circuit board with holes to be plugged abuts against the island area. The aluminum sheet is bonded to the bottom layer of the screen to obtain the aluminum sheet mesh with windows, and then the aluminum sheet mesh is placed on the circuit board to be plugged. Set the window facing the hole to be plugged, set the hole to be plugged facing the air guide between the islands, scrape the copper paste covered with the aluminum mesh into the window, and pour the copper paste into the hole to be plugged through the window . Insert the resin...

Embodiment 2

[0097] Select a breathable plate with a thickness of 2.5mm, and the length of the breathable plate is 50mm larger than the circuit board to be plugged, and the width of the breathable plate is 50mm larger than the circuit board to be plugged. Controlled depth drilling is performed on the air-permeable board to obtain an island area on the air-permeable board. Place the circuit board with holes to be plugged on the air-permeable board, so that the circuit board with holes to be plugged abuts against the island area. The aluminum sheet is bonded to the bottom layer of the screen to obtain the aluminum sheet mesh with windows, and then the aluminum sheet mesh is placed on the circuit board to be plugged. Set the window facing the hole to be plugged, set the hole to be plugged facing the air guide between the islands, scrape the copper paste covered with the aluminum mesh into the window, and pour the copper paste into the hole to be plugged through the window . Insert the resin...

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Abstract

The invention provides a preparation method of a circuit board and the circuit board. The preparation method of the circuit board comprises the following steps: manufacturing a permeable plate, and arranging an island region on the permeable plate; arranging a to-be-plugged circuit board on the ventilation plate, the to-be-plugged circuit board abutting against the island region; bonding an aluminum sheet to the bottom layer of a screen printing plate, and obtaining an aluminum sheet net with a window; placing the aluminum sheet net on the circuit board to be plugged; arranging the window to face the to-be-plugged hole, and arranging the to-be-plugged hole to face an air guide port between the island regions; scarping the copper paste covering the aluminum sheet net into the window, and pouring the copper paste into the to-be-plugged hole through the window; plugging the resin plug into the to-be-plugged hole of the circuit board through the aluminum sheet net; and carrying out curing treatment on the copper paste in the circuit board. According to the preparation method of the circuit board, the plug hole can be smooth and free of bubbles, and the circuit board can be ensured not to deform in the resin plug hole manufacturing process.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for preparing a circuit board and the circuit board. Background technique [0002] With the development of miniaturization of assembled components, the wiring area and pattern design area of ​​the circuit board are also continuously reduced. In order to adapt to this development trend, circuit board designers and manufacturers are constantly updating design concepts and manufacturing methods. The process of resin plugging is also a technical method invented by people to reduce the design size of the circuit board and cooperate with the assembly of components. Its bold design concept and scalable production have indeed exerted a great impetus in the field of circuit board production, effectively improving the reliability and production process capabilities of HDI, thick copper, backplane and other products. Understanding and effectively utilizin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/00
CPCH05K3/4038H05K3/0094H05K2201/095
Inventor 许校彬肖尊民
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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