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Metallized half hole forming method and PCB

A metallized semi-hole and forming method technology, which is applied in the field of PCB board manufacturing, can solve the problems of ridge residue, hole wall copper skin warping, etc., and achieve the effects of reducing production costs, improving the length of the production process, and improving production efficiency

Active Publication Date: 2021-05-04
SHENZHEN KINWONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] This application provides a metallized half-hole forming method and a PCB board to solve the problems of the copper skin on the hole wall lifted and the edge remaining after the metallized half-hole is formed, and at the same time improve production efficiency and reduce production costs

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  • Metallized half hole forming method and PCB
  • Metallized half hole forming method and PCB
  • Metallized half hole forming method and PCB

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Embodiment Construction

[0045] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings, that is, embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0046] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are for convenience of description only, rather than indicating or implying the referred device ...

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Abstract

The invention is suitable for the technical field of printed circuit board manufacturing, and provides a metallized half hole forming method, which comprises the following steps of: drilling a through hole in a PCB (Printed Circuit Board); depositing a copper layer on the surface of the hole wall of the through hole; manufacturing an outer layer circuit on the surface of the PCB; using a rough milling cutter for forming a milling groove in a milling groove forming area on the PCB along the pre-milling line, the milling groove penetrating through the part of the through hole to form a metalized half hole; using a first fine trimming gong cutter for performing first fine trimming on the metalized half hole and the gong groove in the first direction; and performing second-time fine trimming on the metalized half hole and the milling groove along a second direction by using a second fine trimming milling cutter. According to the forming method of the metalized half hole, the problems that the copper sheet in the metalized half hole tilts and burrs remain can be solved, and high production efficiency is achieved. The invention further provides a PCB (printed circuit board).

Description

technical field [0001] The invention relates to the technical field of PCB board manufacture, in particular to a method for forming metallized half holes and a PCB board. Background technique [0002] In the production of Printed Circuit Board (PCB in English), the metallized half hole can not only realize the conduction function of the round hole, but also use the hole wall of the half hole for welding and fixing to realize the fixing of the chip pin. It is a conventional design in the manufacture of printed circuit boards. However, the copper skin on the hole wall after the metallized half-hole is formed, and the problem of the edge remaining has always been a difficult problem in the production of printed circuit board machinery. The copper wires and caps remaining in the metallized semi-holes are likely to cause problems such as weak solder joints, false soldering, and short circuits during soldering of subsequent products. [0003] An existing metallized half-hole pro...

Claims

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Application Information

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IPC IPC(8): H05K3/42H05K3/46H05K3/00
CPCH05K3/429H05K3/4611H05K3/0044H05K2203/061
Inventor 吴茂林黄俊陈龙任城洵谢伦魁杨学军
Owner SHENZHEN KINWONG ELECTRONICS