Omni-directional embedded module and manufacturing method, packaging structure and manufacturing method
A technology of modules and pads, which is applied in the direction of assembling printed circuits with electrical components, manufacturing printed circuits, and printed circuits connected with non-printed electrical components. problems, to achieve the effect of reducing packaging process, improving packaging flexibility, and improving signal transmission path
Active Publication Date: 2022-05-27
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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- Application Information
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Problems solved by technology
In the prior art, the usual practice of embedded passive components is to place a passive component horizontally in a cavity, and then add layers. However, embedded passive components often cannot achieve omni-directional package conduction, which will limit the packaging flexibility and The path of signal transmission and will increase the packaging process
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[0064] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0065] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0066] Some embodiments of the present invention will be described in...
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An omnidirectional embedded module, comprising: an insulating base material, the insulating base material includes a first surface, a second surface opposite to the first surface, and a plurality of connecting the first surface and the The side of the second surface; a plurality of first embedded pads formed on the first surface of the insulating substrate; a plurality of second embedded pads formed on the second surface of the insulating substrate; and a plurality of a sidewall line embedded in the insulating base material and partly exposed from multiple sides of the insulating base material, the multiple sidewall lines are respectively connected to the multiple first embedded pads and the multiple said first embedded pads The second embedded pad is electrically connected. The invention also relates to a manufacturing method, packaging structure and manufacturing method of the omnidirectional embedded module. The omnidirectional embedded module and manufacturing method, packaging structure and manufacturing method provided by the present invention can realize omnidirectional conduction, thereby greatly increasing the packaging flexibility of the packaging structure and the signal transmission path, and reducing the packaging process.
Description
technical field [0001] The invention relates to an omnidirectional embedded module and a manufacturing method thereof, a packaging structure and a manufacturing method thereof. Background technique [0002] In recent years, electronic products have been widely used in daily work and life, and light, thin and small electronic products have become more and more popular. As the main component of electronic products, flexible circuit boards occupy a large space of electronic products. Therefore, the volume of flexible circuit boards affects the volume of electronic products to a large extent. Large-volume flexible circuit boards are bound to be difficult to meet the light weight of electronic products. , thin, short, small trend. [0003] With the development of miniaturization of resistance components, embedded technology came into being. It has the following advantages: reduction of package area and low power consumption, improvement of signal quality, reduction of electroma...
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IPC IPC(8): H05K1/18H05K3/32H05K3/34
CPCH05K1/185H05K3/32H05K3/34H05K2201/09509H05K2203/1316H05K3/403H05K3/0097H05K1/186H05K1/113H05K3/4611H05K2203/0228H05K3/421H05K2201/09409H05K3/429
Inventor 傅志杰
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD