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2results about How to "Reduce packaging process" patented technology

Transistor device and manufacturing method thereof

The invention provides a transistor device and a manufacturing method thereof. The transistor device comprises a channel layer, a barrier layer, a grid electrode, a first electrode, a second electrode, a first connecting block, a second connecting block and a dielectric layer, the barrier layer is stacked on the channel layer, the dielectric layer is stacked on the barrier layer, and the grid electrode is located on the dielectric layer; the contact surface of the channel layer and the barrier layer is provided with two-dimensional electron gas, the two-dimensional electron gas comprises an active region and a resistance region which are spaced from each other, the resistance region is of an annular structure surrounding the active region, and the resistance region is provided with an opening; the first electrode and the second electrode penetrate through the dielectric layer and the barrier layer to be in contact with the active region, the first connecting block and the second connecting block penetrate through the dielectric layer and the barrier layer to be in contact with the two sides of the opening of the resistance region, and the first connecting block is electrically connected with the grid electrode.
Owner:HC SEMITEK ZHEJIANG CO LTD

Data communication method, device and system and storage medium

PendingCN122093017AImprove transmission efficiencyImprove bit error resistance performanceError preventionChecksumEngineering
The invention discloses a data communication method, device and system and a storage medium, and relates to the technical field of Ethernet communication, and the data communication method comprises the steps: firstly obtaining a plurality of data packets generated by an upper-layer application, and then constructing corresponding communication sub-packets according to the data length, the content and the check code of the data packets; and extracting a standard Ethernet frame header, inserting a combined identification field, splicing the communication sub-packets to the identification field in sequence, adding a frame verification sequence to generate a combined packet, and sending the combined packet to a receiving end. And the receiving end executes first integrity check through the frame check sequence, splits the communication sub-packets according to the merging identifier after the first integrity check passes, and executes second integrity check through the communication sub-packet check code to process the effective communication sub-packets. According to the invention, the redundancy overhead is reduced through merging and packaging of multiple small data packets, the equipment compatibility is guaranteed by the standard frame header, the anti-error-code capability is improved through double-layer verification, and the transmission efficiency and the anti-error-code performance of the small data packets can be optimized while the compatibility is considered.
Owner:SHANDONG YUNHAI GUOCHUANG CLOUD COMPUTING EQUIP IND INNOVATION CENT CO LTD