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116results about How to "Reduce packaging process" patented technology

Method for actively encapsulating LED chip and encapsulation structure thereof

The invention discloses an active encapsulation method which utilizes the spontaneous light of a chip to initiate photosensitive resin polymerization for the in-situ preparation of a lens with an LED single layer and multilayer structure. The method includes the following steps: photosensitive resin liquid wave band light which is sensitive to specific wave band light is prepared; an LED semi-finished product which is processed by electrode connection and die bond is presoaked in photosensitive resin for die bond; the LED semi-finished product is inverted to be soaked in the photosensitive resin liquid, low working current is led into and enables the LED chip to be luminous, photosensitive resin is triggered to generate preliminary polymerization, and a photosensitive resin core is formed on the luminous surface of the LED chip; the LED semi-finished product is separated from the surface of the photosensitive resin liquid, and the drops of the photosensitive resin liquid need to be attached to the photosensitive resin core and a chip base; the intermediate working current is led into and enables the LED chip to be luminous, and the drops of the photosensitive resin liquid are stimulated to be solidified; after the solidification of the drops of the photosensitive resin liquid, high working current is led into a sample so as to enable the LED chip to be luminous, and then the steps of solidification and decoloration are carried out, or the sample is irradiated by sunlight, purple light or ultraviolet light to be decolourized; and finally the sample processed by solidification and decoloration is cleaned.
Owner:SUN YAT SEN UNIV

Dispersion strengthening copper-based composite material and preparation method thereof

The invention relates to a dispersion strengthening copper-based composite material and a preparation method thereof. The dispersion strengthening copper-based composite material and the preparation method thereof are characterized in that A dispersion strengthening phase is yttrium oxide, and the content of yttrium oxide in copper is 1-2.5 percent by weight, and the preparation method comprises the processes of alloy smelting, rolling, internal oxidation, reduction and the like. The preparation method has the advantages of short process and low production cost. The tensile strength of the product is greater than 550 MPa, the conductivity exceeds 90 percent IACS (international annealed copper standard), and the softening temperature is higher than 900 DEG C. The dispersion strengthening copper-based composite material has higher mechanical property, excellent electrical conductivity and high-temperature softening resistance. The Y2O3 granulate dispersion strengthening copper-based composite material prepared in the invention can be applied to computer integrated circuit lead frames, resistance welding electrodes for automobile industry, linings of crystallizers of continuous casting machines for metallurgical industry, equipment and carrier rockets, electric car and electric power train aerial conductor and the like, and the character of service and the service life can be obviously improved.
Owner:NANCHANG UNIV

Transistor outline (TO)-CAN packaged semiconductor laser and fabrication method thereof

The invention proposes a transistor outline (TO)-CAN packaged semiconductor laser and a fabrication method thereof. The TO-CAN packaged semiconductor laser comprises a TO tube base, a semiconductor laser chip, a backlight detector chip, a gold bonding wire, pins and a heat sink block, wherein the heat sink block is arranged on the upper surface of the TO tube base, the pins are fixed on the TO tube base in an insulation way, the upper end of at least one pin protrudes out of the upper surface of the TO tube base, the semiconductor laser chip is fixed on the surface of the heat sink block, the upper part of the pin protruding out of the upper surface of the TO tube base is connected with a support table, and the backlight detector chip is arranged on the support table and below the semiconductor laser chip. In the TO-CAN packaged semiconductor laser, the backlight detector chip is arranged on the support table integrated and connected with the pins, thus, an independent cushion block is omitted, and the material cost of the cushion block is saved; and moreover, the gold wire bonding process between the backlight detector chip and the cushion block in one time is omitted, the gold wire bonding process is simplified, the gold wire bonding cost is saved, and the stability of a laser product is improved.
Owner:武汉海赛姆光电技术有限公司

Label adsorption and attachment device and implementation method thereof

The invention discloses a label adsorption and attachment device and an implementation method thereof. The label adsorption and attachment device comprises a stander, wherein a wall plate is vertically arranged on the stander; a material supply polish rod, a flat material guide plate and a pair of tension rollers are arranged on the side surface of the wall plate according to three vertexes of three angles, respectively; a paper-tape coil with labels is arranged on the material supply polish rod in a sleeving manner; the free head of the paper-tape coil runs along the flat material guide plate, passes through a bent position and then is clamped between the two tension rollers; a vacuum cavity type adsorption head is arranged at the bent position in a clutching manner and is arranged on a rotating and lifting power mechanism which is used for driving the vacuum cavity type adsorption head to do reciprocating rotation along an arc trace and can rise and fall along the longitudinal direction. The label adsorption and attachment device can simulate operation of an operator of bending and upwarping an adhesive edge of a label and manually stripping off the label, namely when the paper-tape coil runs to the bent position, the label at the paper-tape coil is upwarped by bending, and furthermore, the vacuum cavity type adsorption head strips off the label by using negative pressure gas; the label is safely, reliably, successfully and efficiently taken in the whole process.
Owner:SHENYANG INST OF AUTOMATION - CHINESE ACAD OF SCI

Flexible package lithium ion battery and processing method thereof

InactiveCN102403530ALow raw material costSave work stations and a certain amount of man-hoursFinal product manufactureSecondary cellsElectrical batteryEngineering
The invention provides a flexible package lithium ion battery and a processing method thereof. The flexible package lithium ion battery comprises a membrane housing, a lug, and an electric core and an electrolyte which are arranged in the membrane housing, wherein the membrane housing is provided with a sheet one-way valve, one end of the sheet one-way valve is inserted into the electric core and the other end of the sheet one-way valve is exposed outside the electric core, and the sheet one-way valve is used for exhausting gas inside the flexible package lithium ion battery. The processing method of the flexible package lithium ion battery comprises the following steps of: A, punching the housing without an air bag; B, coiling the electric core into the membrane housing; C, doubling over along an upper die cavity and a lower die cavity, carrying out tip seal and side seal, packaging the sheet one-way valve on the membrane housing; D, injecting electrolyte, standing until the electrolyte is absorbed completely and vacuumized; E, packaging the electrolyte-injecting side; and F, degassing. Through arranging the sheet one-way valve on the top, gas generated during the degassing can be immediately exhausted, the air bag and the air bag and the right side part of the air bag can be removed during punching the housing, thus raw materials and processing procedures are saved, and packaging effect and safety of the battery are improved.
Owner:SHENZHEN EPT BATTERY

Weighing-type rice packaging machine

The invention discloses a weighing-type rice packaging machine. The weighing-type rice packaging machine comprises a storage box, a support, a weighing device, a funnel, a conveying device and a sealing device, wherein the storage box is arranged at the upper end of the support; two sides of the upper end of the funnel are provided with fixed sheets; a discharge port is arranged at the bottom endof the storage box through the fixed sheets; the discharge port at the lower end of the funnel is connected with a discharge pipe; a flow control valve is arranged on the discharge pipe; a weighing device is arranged at the lower end of the discharge pipe; the weighing device comprises a weighing box, a weighting plate, and a weighting sensor; the weighting box is of a cover-free frame structure,and the open end of the weighing box is directly opposite to the lower portion of the discharge pipe; the weighing box is mounted on the weighing plate; the two sides of the weighing plate are fixed with the support through fixing frames; the weighing sensor is arranged on one side of the weighing plate; a discharge opening is arranged at the bottom end of the weighing box; the discharge opening is connected with a discharge pipeline; an electric control valve is arranged on the discharge pipeline; and a conveying device is arranged at the lower portion of the discharge pipeline.
Owner:南京钢诺智能装备有限公司

Integrated cavity type conductive fluid heat spreader

The invention provides an integrated cavity type conductive fluid heat spreader which includes a cavity (1), the heat absorbing end, flow, liquid, fluid pool, driving pump and a heat radiating end together in one room, the internal cavity structure, and the inner surface is an insulating layer (12); runner type electrode for (31, 32), arranged on the cavity surface, which is used as a channel and the direction of fluid flow regulator; a magnet for (41, 42), in the cavity body and the direction of the magnetic poles and the electrode is arranged on the current direction is vertical range setting; conductive fluid (2), the filling in the cavity; power supply chip (7) which is arranged in the cavity, the outer surface of the electrodes used to provide the input current. According to the heat spreader is provided by the invention greatly reduces the production and packaging process, completely avoid the fluid leakage; the compact volume, heat transfer capacity significantly; the cavity electrode on the position can be set flexibly, significantly enhance the electromagnetic driving force, resulting in the enhancement of heat transfer and flow effect is strong; between different parts of the body temperature of the fluid cavity different mixing efficiency is high, the heat transport capability is strong.
Owner:TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI

Ultrathin RFID intelligent card packaging method

The method is suitable for the technical field of RFID card packaging. The invention discloses an ultra-thin RFID intelligent card packaging method which comprises the following steps: an antenna manufacturing step: winding an enameled wire on a first base material according to a set shape to form an antenna, and removing insulating layers on the surfaces of two leads on the antenna; a mounting step: respectively placing two welding spots on the RFID chip flip-chip bonding pad above the two leads of the antenna with the insulating layer removed; and a lamination forming step: covering a secondbase material on the bonding pad with the welding spots in the mounting step, and enabling the two welding spots on the bonding pad to respectively form close contact with the two leads of the antenna to form electric connection by laminating and melting the first base material and the second base material, i.e., one welding spot is electrically conducted with one antenna lead. Because the two leads of the antenna and the bonding pad do not need to be in hard connection through welding, on one hand, the packaging process can be reduced, and the packaging efficiency is improved; and on the other hand, the thickness of the RFID card can be reduced without welding. And the winding antenna is adopted, so that the precision is high.
Owner:湖北用芯物联科技有限公司

High-efficiency binary transmission protocol based on real-time streaming compression technology

PendingCN108683603AEasy to convertReduced packaging and design complexityData switching networksData transmissionThree level
The invention discloses a high-efficiency binary transmission protocol based on the real-time streaming compression technology, and the abstract design is performed according to an application layer data structure and binary bidirectional conversion, and a corresponding processing class can be generated according to an IDL (intermediate definition file), thereby simplifying the conversion of binary data stream and the application layer data structure, and reducing the packaging and design complexity of a conventional binary protocol. Moreover, a three-level design is employed for the protocol,and a packet header + message base mode is employed, wherein the message base is taken as an abstract layer and is embedded into a third-level business message structure. Because most of intermediatetransmission layers just need to recognize the first-level and second-level messages, and do not need to recognize a specific third-level message, a high-efficiency binary transmission protocol whichis easy to extend can be implemented through the above layered design. Meanwhile, the universal compression design of the second-level message is performed. Compared with a conventional method, the method employed in the invention reduces the data transmission flow by 50%-80%.
Owner:广州经传多赢投资咨询有限公司
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