Ultrathin RFID intelligent card packaging method

Abstract

The method is suitable for the technical field of RFID card packaging. The invention discloses an ultra-thin RFID intelligent card packaging method which comprises the following steps: an antenna manufacturing step: winding an enameled wire on a first base material according to a set shape to form an antenna, and removing insulating layers on the surfaces of two leads on the antenna; a mounting step: respectively placing two welding spots on the RFID chip flip-chip bonding pad above the two leads of the antenna with the insulating layer removed; and a lamination forming step: covering a secondbase material on the bonding pad with the welding spots in the mounting step, and enabling the two welding spots on the bonding pad to respectively form close contact with the two leads of the antenna to form electric connection by laminating and melting the first base material and the second base material, i.e., one welding spot is electrically conducted with one antenna lead. Because the two leads of the antenna and the bonding pad do not need to be in hard connection through welding, on one hand, the packaging process can be reduced, and the packaging efficiency is improved; and on the other hand, the thickness of the RFID card can be reduced without welding. And the winding antenna is adopted, so that the precision is high.

Description

Technical field [0001] The invention relates to the technical field of RFID card packaging, in particular to an ultra-thin RFID smart card packaging method. Background technique [0002] As RFID card users demand thinner and thinner, the existing RFID card package can only be made by etching the antenna on the substrate. However, due to the accuracy of the etching antenna, the electrical performance of the transmission line of the etching antenna, such as insufficient accuracy of parasitic inductance parameters, affects the performance of the antenna. At the same time, when the signal transmission distance needs to be increased to make a longer antenna, the etching antenna cannot be stacked. The electrical performance of the antenna made by the enameled wire winding method has high accuracy, but the connection point needs to be welded to the pad, and the RFID chip needs to be bonded to the pad, which makes the RFID chip position thicker and increases the thickness of the RFID car...

AI Technical Summary

Problems solved by technology

However, due to the accuracy of the etched antenna, the electrical performance of the etched antenna's transmission line, such as the lack of accuracy of the parasitic inductance parameter, affects the performance of the antenna. At the same time, when the signal transmission distance needs to be increased to make a longer antenna, the etched antenna cannot be stacked.

The electrical performance of the antenna made by the enameled wire winding method is high, but the connection point needs to be welded to the pad, and the RFID chip needs to be bonded to the pad, which makes the position of the RFID chip relatively thick and increases the thickness of the RFID card. It is also necessary to increase the process

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