Packaging method and display device

A packaging method and technology for packaging substrates, which are applied in the manufacture of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., and can solve problems such as cracking or peeling, sealing failure of display devices or thin-film devices, and many processes.

Inactive Publication Date: 2014-04-09
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the process of realizing the above-mentioned packaging, the existing technology mainly has the following problems: firstly, the whole packaging process needs to be coated with UV curing glue and other processes, and the number of processes is too many, which is not conducive to improving mass production efficiency; secondly, in the radiation process of

Method used

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  • Packaging method and display device
  • Packaging method and display device

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] The embodiment of the present invention provides a packaging method, such as figure 1 As shown, the packaging method includes the steps of:

[0039] S01, such as figure 2 As shown, the encapsulation region 10a of the first glass substrate 10 is formed as image 3 The glass glue 30 pattern layer shown.

[0040] S02. Combination image 3 and Figure 4 As shown, the packaging substrate formed with the glass glue 30 is attached to the device substrate...

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Abstract

The embodiment of the invention provides a packaging method and a display device and relates to the field of display device packaging preparation. The process of the packaging method can be simplified, and the occurrence of the phenomenon that stress is generated inside glass glue when laser beams are irradiated on the glass glue so as to cause poor packaging such as packaging glass cracking or peeling-off can be reduced. The packaging method comprises the following steps: forming a glass glue pattern layer in a packaging area of a first glass substrate; fitting the packaging substrate on which the glass glue is formed onto a device substrate to enable the packaging area of the packaging substrate to be aligned with a packaging area of the device substrate; and irradiating laser on the packaging areas, sintering the glass glue and applying uniform pressing force to the packaging areas during laser irradiation. The packaging method is used in packaging preparation of a display device needing to be isolated from the surrounding environment during packaging.

Description

technical field [0001] The invention relates to the field of packaging preparation of display devices, in particular to a packaging method and a display device. Background technique [0002] When manufacturing displays or thin film devices, because the electronic components and photoelectric devices inside the display or thin film devices are easy to react with water and oxygen in the air, the performance of the display or thin film devices will be invalid. Therefore, it is necessary to check the upper and lower substrates of the display or thin film devices Sealing; At present, in order to improve the airtightness between the upper and lower substrates in displays or thin film devices, glass glue is often used as the medium for joining the two substrates, and the glass glue is bonded to the upper and lower substrates respectively by thermal sintering , so as to prevent external water vapor and oxygen from entering the device, thereby prolonging the service life of the displ...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/84H10K50/8426H10K71/00H10K50/80
Inventor 王丹
Owner BOE TECH GRP CO LTD
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