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Camera module and electronic equipment

A camera module and chip module technology, applied in TV, electrical components, image communication, etc., can solve problems such as affecting the imaging effect and the inability of the anti-shake system to dissipate heat, so as to achieve heat dissipation effect, good heat dissipation effect, and improve user experience. Effect

Active Publication Date: 2022-07-29
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiment of the present application is to provide a camera module and electronic equipment, which can solve the problem that the conventional imaging chip anti-shake system cannot dissipate heat and affect the imaging effect

Method used

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  • Camera module and electronic equipment
  • Camera module and electronic equipment
  • Camera module and electronic equipment

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Embodiment Construction

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0039] The terms "first", "second" and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish ...

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Abstract

The application discloses a camera module and electronic equipment, and relates to the field of electronic products. A camera module, comprising: a lens module; a chip module, the chip module is arranged opposite to the lens module; an anti-shake module, the anti-shake module is connected with the chip module, and the anti-shake module drives the The chip module moves in a first plane, and the first plane is perpendicular to the optical axis of the lens module; the heat dissipation module includes a heat dissipation assembly and a heat dissipation member, and the heat dissipation assembly is arranged on the heat dissipation member, The chip module is disposed on the heat-conducting component, and the chip module is movable relative to the heat-conducting component. An electronic device includes the above-mentioned camera module. The present application solves the problem that the conventional imaging chip anti-shake system cannot dissipate heat, which affects the imaging effect.

Description

technical field [0001] The application belongs to the technical field of electronic products, and specifically relates to a camera module and an electronic device. Background technique [0002] At present, some electronic devices, in order to meet the needs of high-definition and stable shooting, require electronic devices to have a powerful imaging chip anti-shake system and a high-quality chip. However, with the improvement of chip pixels, its heat generation is gradually increasing. At the same time, the anti-shake system of the imaging chip will perform multi-angle compensation movements during operation, and this process will also generate heat. In this way, during the long-term photographing and video recording process, the heat generated is high, noise, noise, etc. are greatly increased, so This results in poor imaging results and affects user experience. SUMMARY OF THE INVENTION [0003] The purpose of the embodiments of the present application is to provide a cam...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225G03B17/55
CPCG03B17/55H04N23/52H04N23/54H04N23/57H04N23/55
Inventor 杨泽熊玲丁文超杨茹
Owner VIVO MOBILE COMM CO LTD