Heat dissipation structure and electronic device

A technology of heat dissipation structure and electronic device, applied in the direction of TV, color TV, telephone communication, etc., can solve the problem of poor heat dissipation of camera module, and achieve the effect of avoiding heat deformation

Pending Publication Date: 2021-05-14
TRIPLE WIN TECH JIN CHENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a heat dissipation structure to solve the problem of poor heat dissipation of the camera module

Method used

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  • Heat dissipation structure and electronic device
  • Heat dissipation structure and electronic device
  • Heat dissipation structure and electronic device

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Embodiment Construction

[0059] Below will combine specific embodiment and appended Figure 1-3 The technical solution of the present invention is clearly and completely described. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0060] In describing the embodiments of the present invention, it should be understood that the terms "center", "longitudinal", "tr...

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Abstract

A heat dissipation structure is arranged in an electronic device, the electronic device comprises a camera module, the heat dissipation structure comprises a heat dissipation body, a sealing cavity arranged in the heat dissipation body and a heat transfer medium sealed in the sealing cavity, wherein the sealing cavity comprises an evaporation section and a condensation section communicated with the evaporation section. The heat dissipation structure further comprises a connecting plate connected to the evaporation section, the connecting plate is used for fixing the camera module, so that the camera module transmits generated heat to the connecting plate, the connecting plate transmits the heat to the evaporation section, and the heat transfer medium absorbs the heat in the evaporation section and is gasified to enter the condensation section. And the gasified heat transfer medium is liquefied at the condensation section and dissipates heat out of the electronic device. According to the heat dissipation structure provided by the invention, heat generated by the camera module can be rapidly taken away, and the problem that the imaging quality is reduced due to thermal deformation of the photosensitive chip or change of internal air density is avoided. In addition, the invention also provides an electronic device with the heat dissipation structure.

Description

technical field [0001] The invention relates to a heat dissipation structure and an electronic device. Background technique [0002] Mobile phone camera modules usually include components such as an optical lens, a base body, a photosensitive chip, and a circuit board. The photosensitive chip is arranged in a closed space formed by the base body and the circuit board. The work causes the chip to be thermally deformed or the internal air density changes, and the imaging quality is seriously reduced. Contents of the invention [0003] In view of this, the present invention provides a heat dissipation structure to solve the problem of poor heat dissipation of the camera module. [0004] In addition, the present invention also provides an electronic device with the above heat dissipation structure. [0005] A heat dissipation structure installed in an electronic device, the electronic device includes a camera module, the heat dissipation structure includes a heat dissipation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03B17/55H04N5/225
CPCG03B17/55H04N23/52F28D15/043F28D15/04H04M1/026H04M1/0264G06F1/20G03B30/00G06F1/203G06F1/1658H05K7/20336H05K7/20318H05K7/20309H05K7/20327
Inventor 陈信文李静伟宋建超丁盛杰
Owner TRIPLE WIN TECH JIN CHENG CO LTD
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