Silicon wafer positive photoresist etching equipment and process for power supply chip production

Abstract

The invention relates to the technical field of silicon wafer preparation devices, and discloses silicon wafer positive photoresist etching equipment and process for power supply chip production, temperature detection can be carried out on a photoresist through arrangement of a temperature sensor, when the temperature is too low, a heating wire starts to heat the photoresist, and the activity of the photoresist is enhanced, so the sprayed-out photoresist is capable of increasing the speed of etching the silicon wafer. The two position indicators detect the silicon wafer, when the silicon wafer is detected, the position indicators transmit signals into the position processor through the conduction wires, the central controller starts the liquid pump through the intermittent wire, the liquid inlet pipe discharges the photoresist in the liquid storage tank into the liquid pump, the resist is squeezed out of the liquid pipe under the pressurization action of the liquid pump and finally sprayed on the silicon wafer through a porous spray head, and when the position indicators cannot detect the silicon wafer, the liquid pump stops working, so that intermittent spraying is realized, and waste of the resist caused by continuous spraying is prevented.

Description

technical field [0001] The invention relates to the technical field of silicon wafer preparation devices, in particular to silicon wafer positive photoresist etching equipment and technology for power chip production. Background technique [0002] The production of power chips includes the step of etching. The etching process is a key step in transferring the circuit layout to the chip, including etching and cleaning after etching. At this stage, the etching and cleaning technology required for multi-layer wires is the focus. Etching technology development has completed the 0.2-micron contact window etching technology that meets the 0.15-micron generation process specification and the aluminum wire etching technology that meets the 0.18-micron generation process specification (line width / space=0.22 micron / 0.23 micron); at the same time, the photoresist hardening technology has been completed. It can improve photoresist etching by 10% to 20%. The current technical focus is on...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides silicon wafer positive photoresist etching equipment for the production of power chips, which has the advantages of intermittent spraying of resist and heating of the resist, and solves the waste of resist spraying. and the problem of slow etching speed

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