Iterative method and device for integrated circuit current distribution dynamically applied by interlayer coupling

Abstract

The present invention provides an iterative method and device for inter-layer coupling dynamic application of integrated circuit current distribution, wherein the iterative method includes the following steps: first, the initial active layer whose source layer is affected by other layers is set as all layers of the integrated circuit; secondly, the source layer is The current distribution of the source layer is iterated. In each iteration, the influence of other layers on the source layer is calculated by the dyadic Green’s function, and the influence is accumulated as the source item of the source layer, and the two-dimensional finite element is applied to the source layer to calculate its field distribution. Update the field and current distribution of this layer to obtain the change of the source layer field; then determine the negligible layer through the effective influence value of the dyadic Green’s function, and then dynamically modify the range of the source layer affected by other layers; Layers are iterated repeatedly until the influence changes of all source layers cause the field changes of the affected layer to be less than the specified threshold, and the iteration ends. The application can reduce the complexity of three-dimensional problems and occupy memory without reducing the calculation accuracy.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an iterative method and device for integrated circuit current distribution dynamically applied by interlayer coupling. Background technique [0002] When the integrated circuit is working, due to the transmission of high-speed signals on its multi-layer layout, a high-frequency alternating electromagnetic field will be formed. on a small semiconductor substrate. In order to achieve more functions, VLSI has dozens to hundreds of layers of structure, each layer structure is extremely complex, integrating millions or even tens of millions of transistors, and has a multi-scale structure, from the centimeter level to the latest state-of-the-art nanoscale. In order to ensure that the integrated circuit can work normally and realize the functions designed in advance, it is necessary to ensure the power integrity and signal integrity of the integrated circuit first. Accura...

AI Technical Summary

Problems solved by technology

Since the method of moments only integrates for the interface, it will reduce a large number of grid units and unknown quantities. However, since the scale of integrated circuits ranges from nanometers to centimeters, directly solving the whole integrated circuit with the finite element method itself will cause problems. Huge sparse matrix, and due to the coupling of the finite element method and the method of moments, the formed coupling matrix is ​​a dense matrix at the interface, which greatly increases the number of non-zero elements of the entire sparse matrix and the complexity of the sparse matrix solution, making the calculation time still very long

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