Multi-base-island chip packaging structure and packaging method

A technology of packaging structure and packaging method, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve problems such as long production time

Pending Publication Date: 2021-05-18
HUAYUAN SEMICON SHENZHEN LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a multi-base island chip packaging structu

Method used

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  • Multi-base-island chip packaging structure and packaging method
  • Multi-base-island chip packaging structure and packaging method
  • Multi-base-island chip packaging structure and packaging method

Examples

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Example Embodiment

[0070]Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0071]In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the term "upper", "lower", "upper end", "lower end", "lower surface", "upper surface", etc. is based on the drawings. The orientation or positional relationship shown is intended to facilitate the description of the present invention and simplified description, rather than indicating or implying that the device or component must have a specific orientation, and therefore cannot be understood as th...

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Abstract

The invention provides a multi-base-island chip packaging structure and packaging method. The multi-base-island chip packaging structure comprises a frame, M first target bare chips and M second target bare chips, and the frame comprises M base islands; different first target bare chips are arranged on different base islands, the M first target bare chips are the same bare chips, the centers of the M first target bare chips are sequentially distributed along a first direction, and the deflection angles of the M first target bare chips relative to the first direction are the same; different second target bare chips are arranged on different base islands, the M second target bare chips are the same bare chips, the centers of the M second target bare chips are sequentially distributed in the first direction, and the deflection angles of the M second target bare chips relative to the first direction are the same.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to a multi-base island chip packaging structure and packaging method. Background technique [0002] Semiconductor packaging refers to the process of packaging independent chips processed from tested wafers according to product models and functional requirements. The packaging process is: the wafer from the wafer factory is cut into small chips (Die) after the cutting process, and then the cut chip is mounted on the corresponding base island of the corresponding substrate, and then the ultra-fine metal (Die) is used to Gold, silver, copper) wires connect the bonding pads (Bond Pad) of the chip to the corresponding pins (Lead) of the substrate and form the required circuit; then the independent chip is molded by injection molding or epoxy resin Encapsulation protection, after plastic sealing, it needs to be cut, tinned, and packaged. After the packaging is completed, the finished produ...

Claims

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Application Information

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IPC IPC(8): H01L25/07H01L21/98H01L23/495H01L21/50
CPCH01L25/072H01L25/50H01L23/49503H01L23/49562H01L21/50H01L2224/48137H01L2224/49111H01L2224/0603
Inventor 汪金张超
Owner HUAYUAN SEMICON SHENZHEN LTD
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