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Preparation method and preparation device of flexible electronic device

A technology for flexible electronic devices and preparation devices, which can be applied in the fields of electric solid-state devices, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve problems such as cracks or wrinkles in sensitive cells

Pending Publication Date: 2021-05-18
SUZHOU INST OF BIOMEDICAL ENG & TECH CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art that uniaxial stretching of the substrate during the preparation of flexible electronic devices easily leads to cracks or wrinkles after the sensitive unit retracts.

Method used

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  • Preparation method and preparation device of flexible electronic device
  • Preparation method and preparation device of flexible electronic device
  • Preparation method and preparation device of flexible electronic device

Examples

Experimental program
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Effect test

Embodiment 1

[0040] This embodiment provides a method for preparing a flexible electronic device, comprising the following steps:

[0041] Stretch the flexible substrate 5 uniformly along the outer contour direction;

[0042] After the flexible substrate 5 is stretched in place, in the stretched state of the flexible substrate 5, the material of the sensitive unit 6 is coated on the surface of the flexible substrate 5 in an array;

[0043] After the material of the sensitive unit 6 on the flexible substrate 5 is solidified, the flexible substrate 5 is released to shrink back to its original size.

[0044] In this preparation method, the flexible substrate 5 is uniformly stretched along the outer contour direction of the flexible substrate 5, so that the flexible substrate 5 is deformed and extended outward in the contour direction; The flexible substrate 5 is then released to shrink back to its original size. Since the flexible substrate 5 is uniformly deformed outward along the directio...

Embodiment 2

[0051] This embodiment provides a preparation device for flexible electronic devices, such as figure 2 As shown, it includes a base 1 , at least three sets of stretching components 2 and spraying components 3 .

[0052] Wherein, the upper part of the base 1 is provided with an inwardly recessed recessed area; the flexible substrate 5 is suitable to be placed in the recessed area; at least three sets of tensile components 2 are arranged on the base 1 and are evenly distributed along the contour direction of the recessed area, The stretching assembly 2 is suitable for clamping the flexible substrate 5 in at least three directions and uniformly stretching or releasing it; the spraying assembly 3 is arranged on the top of the base 1; the spraying assembly 3 includes a spray head 31, and the spray head 31 is suitable for The material of the sensitive unit 6 is coated on the surface of the flexible substrate 5 in an array.

[0053] In the preparation device of the flexible electro...

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Abstract

The invention provides a preparation method and a preparation device of a flexible electronic device. The preparation method comprises the following steps: uniformly stretching a flexible substrate along the outer contour direction of the flexible substrate; after the flexible substrate is stretched in place, under the stretching state of the flexible substrate, coating the sensitive unit materials on the surface of the flexible substrate in an array mode; and after the sensitive unit material on the flexible substrate is cured, releasing the flexible substrate to enable the flexible substrate to retract to the initial size. According to the preparation method, the flexible substrate is uniformly stretched along the outer contour direction of the flexible substrate, so that the flexible substrate is uniformly deformed outwards along the outer contour direction, the periphery of the flexible substrate is uniformly retracted after the flexible substrate is retracted, the sensitive unit coated on the surface of the flexible substrate is uniformly retracted along with the flexible substrate, the sensitive unit is uniformly retracted, and the strain of the sensitive unit in each direction is uniform; and after retraction, the sensitive unit does not generate cracks or wrinkles.

Description

technical field [0001] The invention relates to the technical field of flexible electronic devices, in particular to a method for preparing a flexible electronic device and a preparation device thereof. Background technique [0002] Flexible electronics refers to the emerging electronic technology that makes organic / inorganic material electronic devices on flexible / ductile substrates. The development of flexible electronic devices prepared by flexible electronic technology will subvert traditional human-computer interaction methods and promote artificial intelligence, intelligent manufacturing, Revolutionary development in the fields of health care, sports and entertainment. [0003] The existing manufacturing method of flexible electronic devices is generally to uniaxially stretch the flexible substrate first, then coat the sensitive unit on the substrate, and finally release the substrate, and the substrate and the coated sensitive unit shrink. The substrate of the above-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/00H10K99/00
CPCH10K71/00H10K77/111Y02E10/549Y02P70/50
Inventor 李传宇郭振张威姚佳周连群李超张芷齐
Owner SUZHOU INST OF BIOMEDICAL ENG & TECH CHINESE ACADEMY OF SCI
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