A kind of circuit board and its manufacturing method
A manufacturing method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of unfavorable equipment miniaturization and high cost, and achieve material saving, cost reduction, and simplified plate making in the via filling process. Effects of systems and processes
Active Publication Date: 2022-03-01
BEIJING DREAM INK TECH CO LTD
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] In view of this, an object of the present invention is to propose a method for manufacturing a circuit board to solve the problems in the prior art that metallized holes need to be equipped with additional equipment, the cost is high, and it is not conducive to the development trend of equipment miniaturization and integration.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0024] The following description and drawings illustrate specific embodiments of the invention sufficiently to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present invention includes the full scope of the claims, and all available equivalents of the claims. These embodiments of the present invention may be referred to herein, individually or collectively, by the term "invention", which is for convenience only and is not intended to automatically limit the application if in fact more than one invention is disclosed The scope is any individual invention or inventive concept.
...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The embodiment of the invention discloses a circuit board and a manufacturing method thereof, which relate to the technical field of electronic circuit manufacturing; the manufacturing method of the circuit board includes: selecting a base material with via holes; hole; drive the extrusion print head to extend into the via hole, keep rotating with a set gap between the hole wall and the hole wall, and apply the electronic paste on the hole wall to complete the metallization of the via hole; The set gap satisfies the following formula: 0<L≤T; wherein, L is the set gap, and T is the thickness of the electronic paste adhered to the end of the extrusion print head. The manufacturing method of the circuit board in the embodiment of the present invention realizes the metallization of the via hole of the circuit board through the printing equipment, no additional scraping device is required, and the simplified plate making system and process can realize the integrated manufacturing platform of the circuit and the via hole; Moreover, compared with the scraping process of the via hole, the via hole filling process of the present invention is more material-saving and beneficial to cost reduction.
Description
technical field [0001] The invention belongs to the technical field of electronic circuit manufacturing, and in particular relates to a circuit board and a manufacturing method thereof. Background technique [0002] Printed circuit boards {Printed circuit boards}, also known as printed circuit boards, are providers of electrical connections for electronic components. The traditional manufacturing process in the industry is to use copper clad laminates to form electronic circuits by etching. Due to its mature technology and low cost advantages, it is still the main plate making process in the industry, but it also has complex processes and production pollution waste. However, many alternative processes have emerged, such as the additive manufacturing process that uses electronic paste for printing and molding. This technology has the advantages of high efficiency, no pollution, and can meet the needs of users' personalized production. [0003] Although the use of printing to...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/11
CPCH05K3/0088H05K3/0094H05K1/116H05K2203/0736
Inventor 朱文杰
Owner BEIJING DREAM INK TECH CO LTD