Millimeter wave communication AIP module

Abstract

The invention relates to the technical field of packaging, and provides a millimeter wave communication AIP module which comprises an antenna radiation unit and a radio frequency chip, the radiation unit is arranged on the top layer of the AIP module, and the radio frequency chip is arranged on the bottom layer of the AIP module; a plurality of functional layers and a plurality of dielectric layers are arranged between the antenna radiation unit and the radio frequency chip, and the functional layers and the dielectric layers are stacked; the radiation unit is coupled with or directly feeds the radio frequency chip, the radio frequency chip transmits and / or receives a radio frequency signal through the antenna radiation unit, and the radio frequency signal is a millimeter wave signal. In the practical application process, the antenna radiation unit and the radio frequency chip are packaged in one module, so that the formed AIP module can be directly welded on a circuit board, the number of design layers of a PCB (Printed Circuit Board) is greatly reduced, the design difficulty is reduced, and the AIP module is convenient to assemble and maintain.

Description

technical field [0001] The present application relates to the field of packaging technology, in particular to a millimeter wave communication AIP module. Background technique [0002] With the development of 5G communication, satellite communication, vehicle communication and other technologies, the integration demand of millimeter wave frequency band is increasing day by day. The overlapping wavelength ranges thus have the characteristics of both spectra. Millimeter wave antennas have the advantages of extremely wide bandwidth and narrow beams, and compared with lasers, the propagation of millimeter waves is much less affected by the climate, which can be considered to have all-weather characteristics. Compared with microwaves, millimeter wave components The size is much smaller, so mmWave systems are easier to miniaturize. [0003] As for millimeter wave communication, due to the relatively large spatial propagation loss, it generally needs to be realized by forming an a...

AI Technical Summary

Problems solved by technology

However, for the RF active antenna array with a large number of units and a large array, PCB technology is more difficult in stack design and processing.

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