Semiconductor structure, preparation process thereof, and electronic device
A preparation process and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of reduced electromagnetic interference shielding effect, damage of metal electromagnetic shielding cover, and chip affecting heat dissipation effect, etc. To achieve the effect of optimizing heat dissipation, enhancing the firmness of bonding, and increasing the surface area
Pending Publication Date: 2021-06-01
CHANGXIN MEMORY TECH INC
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Problems solved by technology
Because the surface of the existing chip, especially the back surface far away from the substrate, is usually a smooth surface, the heat dissipation effect of the chip is affected due to the limited heat dissipation area.
Moreover, in the existing design, when the surface of the packaging structure is subjected to external force or environmental impact, it is easy to cause damage to the metal electromagnetic shielding cover, resulting in the reduction or even loss of the electromagnetic interference shielding effect
Method used
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[0044] Typical embodiments that embody the features and advantages of the present disclosure will be described in detail in the following description. It should be understood that the present disclosure can have various changes in different embodiments without departing from the scope of the present disclosure, and that the description and drawings therein are illustrative in nature and not intended to limit the present disclosure. public.
[0045]In the following description of various exemplary embodiments of the present disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which are shown, by way of example, various exemplary structures, systems, which may implement aspects of the present disclosure and steps. It is to be understood that other specific arrangements of components, structures, exemplary devices, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope of ...
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Abstract
The invention provides a semiconductor structure, a preparation process thereof and an electronic device. The semiconductor structure includes a chip and an insulating layer. The chip is provided with a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, the first surface is a functional surface of the chip, and the second surface is of a non-planar structure, so that the surface area of the second surface is larger than that of the first surface. The insulating layer is formed and covers the second surface and the side surface of the chip. Through the design, the surface area of the second surface of the chip is increased, so that the heat dissipation area of the chip is increased, and the heat dissipation effect of the chip and the whole semiconductor structure is further optimized. In addition, the bonding firmness between the chip and other laminated structures can be enhanced by using the insulating layer, so that the structural strength of the semiconductor structure is improved.
Description
technical field [0001] The present disclosure relates to the technical field of semiconductor devices, and in particular to a semiconductor structure, a manufacturing process thereof, and an electronic device. Background technique [0002] As a typical packaging structure of existing semiconductor devices, the semiconductor structure is widely used in the industry. Existing semiconductor structures generally include a substrate (Package Substrate), a chip (Chip), a plastic packaging layer (Molding compound) and a metal electromagnetic shield. Since the surface of the existing chip, especially the back surface far away from the substrate, is usually a smooth surface, the heat dissipation effect of the chip is affected due to the limited heat dissipation area of the chip. Moreover, in the existing design, when the surface of the packaging structure is impacted by external force or environment, it is easy to cause damage to the metal electromagnetic shielding cover, thereby ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/31H01L23/367H01L23/552H01L21/56
CPCH01L23/3185H01L23/3114H01L23/367H01L23/552H01L21/56
Inventor 庄凌艺
Owner CHANGXIN MEMORY TECH INC